Inventor
IWANO TOMOHIRO
JP43 patents
⚠️ This page may combine multiple inventors who share the name “IWANO TOMOHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
25 patentsUS10131819B2Nov 20, 2018
Slurry, polishing solution set, polishing solution, and substrate polishing method
HITACHI CHEMICAL CO LTD7 citations84
US10196542B2Feb 5, 2019
Abrasive, abrasive set, and method for abrading substrate
HITACHI CHEMICAL CO LTD9 citations83
US9932497B2Apr 3, 2018
Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate
HITACHI CHEMICAL CO LTD7 citations83
US9346978B2May 24, 2016
Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate
HITACHI CHEMICAL CO LTD9 citations83
US9163162B2Oct 20, 2015
Polishing agent, polishing agent set and method for polishing base
HITACHI CHEMICAL CO LTD7 citations83
US9346977B2May 24, 2016
Abrasive, abrasive set, and method for abrading substrate
HITACHI CHEMICAL CO LTD3 citations72
US10155886B2Dec 18, 2018
Polishing liquid for CMP, and polishing method
HITACHI CHEMICAL CO LTD2 citations71
US11773291B2Oct 3, 2023
Polishing liquid, polishing liquid set, and polishing method
HITACHI CHEMICAL CO LTD0 citations62
US11767448B2Sep 26, 2023
Polishing liquid, polishing liquid set, and polishing method
HITACHI CHEMICAL CO LTD0 citations62
US11572490B2Feb 7, 2023
Polishing liquid, polishing liquid set, and polishing method
HITACHI CHEMICAL CO LTD0 citations62
US11566150B2Jan 31, 2023
Slurry and polishing method
HITACHI CHEMICAL CO LTD0 citations62
US11352523B2Jun 7, 2022
Polishing liquid, polishing liquid set and polishing method
HITACHI CHEMICAL CO LTD0 citations62
US11655394B2May 23, 2023
Polishing solution and polishing method
HITACHI CHEMICAL CO LTD0 citations60
US11578236B2Feb 14, 2023
Slurry, polishing-liquid set, polishing liquid, and polishing method for base
HITACHI CHEMICAL CO LTD0 citations59
US10752807B2Aug 25, 2020
Slurry, polishing-liquid set, polishing liquid, method for polishing substrate, and substrate
HITACHI CHEMICAL CO LTD1 citations59
US11046869B2Jun 29, 2021
Polishing liquid, polishing liquid set, and substrate polishing method
HITACHI CHEMICAL CO LTD0 citations58
US10946494B2Mar 16, 2021
Polishing agent, stock solution for polishing agent, and polishing method
HITACHI CHEMICAL CO LTD0 citations57
US11702569B2Jul 18, 2023
Slurry and polishing method
HITACHI CHEMICAL CO LTD0 citations52
US10825687B2Nov 3, 2020
Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
HITACHI CHEMICAL CO LTD0 citations52
US10759968B2Sep 1, 2020
Abrasive, abrasive set, and method for polishing substrate
HITACHI CHEMICAL CO LTD0 citations51
US10557059B2Feb 11, 2020
Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate
HITACHI CHEMICAL CO LTD0 citations51
US10557058B2Feb 11, 2020
Polishing agent, polishing agent set, and substrate polishing method
HITACHI CHEMICAL CO LTD0 citations51
US10549399B2Feb 4, 2020
Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate
HITACHI CHEMICAL CO LTD0 citations51
US10030172B2Jul 24, 2018
Abrasive, abrasive set, and method for polishing substrate
HITACHI CHEMICAL CO LTD0 citations51
US10703947B2Jul 7, 2020
Slurry, polishing fluid set, polishing fluid, and substrate polishing method using same
HITACHI CHEMICAL CO LTD0 citations49
SHOWA DENKO MATERIALS CO LTD
8 patentsUS11518920B2Dec 6, 2022
Slurry, and polishing method
SHOWA DENKO MATERIALS CO LTD4 citations84
US11505731B2Nov 22, 2022
Slurry and polishing method
SHOWA DENKO MATERIALS CO LTD4 citations83
US11499078B2Nov 15, 2022
Slurry, polishing solution production method, and polishing method
SHOWA DENKO MATERIALS CO LTD4 citations83
US11492526B2Nov 8, 2022
Slurry, method for producing polishing liquid, and polishing method
SHOWA DENKO MATERIALS CO LTD4 citations83
US12104112B2Oct 1, 2024
Slurry, screening method, and polishing method
SHOWA DENKO MATERIALS CO LTD1 citations72
US12258491B2Mar 25, 2025
Polishing liquid, polishing liquid set, and polishing method
SHOWA DENKO MATERIALS CO LTD0 citations62
US12173219B2Dec 24, 2024
Slurry and polishing method
SHOWA DENKO MATERIALS CO LTD0 citations62
US11814548B2Nov 14, 2023
Polishing liquid, polishing liquid set, and polishing method
SHOWA DENKO MATERIALS CO LTD0 citations62
IWANO TOMOHIRO
5 patentsUS9881801B2Jan 30, 2018
Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
IWANO TOMOHIRO7 citations83
US9881802B2Jan 30, 2018
Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
IWANO TOMOHIRO6 citations83
US9988573B2Jun 5, 2018
Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
IWANO TOMOHIRO7 citations82
US9982177B2May 29, 2018
Slurry, polishing fluid set, polishing fluid, and substrate polishing method using same
IWANO TOMOHIRO6 citations81
US9039796B2May 26, 2015
Method for producing abrasive grains, method for producing slurry, and method for producing polishing liquid
IWANO TOMOHIRO1 citations48
RESONAC CORP
3 patentsUS12247140B2Mar 11, 2025
Slurry and polishing method
RESONAC CORP0 citations62
US12565599B2Mar 3, 2026
Slurry, polishing method, and method for manufacturing semiconductor component
RESONAC CORP0 citations54
US12522748B2Jan 13, 2026
Slurry, polishing method, and method for producing semiconductor component
RESONAC CORP0 citations54