Inventor
PARK KYU-CHARN
KR39 patents
⚠️ This page may combine multiple inventors who share the name “PARK KYU-CHARN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
34 patentsUS6376876B1Apr 23, 2002
NAND-type flash memory devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD291 citations98
US6064092AMay 16, 2000
Semiconductor-on-insulator substrates containing electrically insulating mesas
SAMSUNG ELECTRONICS CO LTD53 citations96
US6380032B1Apr 30, 2002
Flash memory device and method of making same
SAMSUNG ELECTRONICS CO LTD63 citations95
US7230294B2Jun 12, 2007
Non-volatile memory devices having a multi-layered charge storage layer and methods of forming the same
SAMSUNG ELECTRONICS CO LTD25 citations93
US7061044B2Jun 13, 2006
Non-volatile memory device
SAMSUNG ELECTRONICS CO LTD17 citations92
US6797570B2Sep 28, 2004
NAND-type flash memory devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD19 citations92
US6624464B2Sep 23, 2003
Highly integrated non-volatile memory cell array having a high program speed
SAMSUNG ELECTRONICS CO LTD38 citations92
US6521941B2Feb 18, 2003
Non-volatile memory device and fabrication method thereof
SAMSUNG ELECTRONICS CO LTD21 citations92
US6515329B2Feb 4, 2003
Flash memory device and method of making same
SAMSUNG ELECTRONICS CO LTD33 citations92
US6936885B2Aug 30, 2005
NAND-type flash memory devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD29 citations91
US6720579B2Apr 13, 2004
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD20 citations91
US7915138B2Mar 29, 2011
Methods of manufacturing non-volatile memory devices
SAMSUNG ELECTRONICS CO LTD7 citations84
US7883929B2Feb 8, 2011
Methods of manufacturing non-volatile memory devices by implanting metal ions into grain boundaries of variable resistance layers
SAMSUNG ELECTRONICS CO LTD12 citations84
US7868467B2Jan 11, 2011
Semiconductor device
SAMSUNG ELECTRONICS CO LTD8 citations84
US7508048B2Mar 24, 2009
Methods of fabricating a semiconductor device having multi-gate insulation layers and semiconductor devices fabricated thereby
SAMSUNG ELECTRONICS CO LTD12 citations84
US6737335B2May 18, 2004
Shallow trench isolation type semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD14 citations84
US6960500B2Nov 1, 2005
Semiconductor device and method of manufacturing the same including forming metal silicide gate lines and source lines
SAMSUNG ELECTRONICS CO LTD13 citations83
US7534684B2May 19, 2009
Methods of forming non-volatile memory devices having a multi-layered charge storage layer
SAMSUNG ELECTRONICS CO LTD6 citations74
US6979628B2Dec 27, 2005
Methods of forming semiconductor devices having field oxides in trenches and devices formed thereby
SAMSUNG ELECTRONICS CO LTD10 citations74
US6903406B2Jun 7, 2005
Cells of nonvolatile memory device with high inter-layer dielectric constant
SAMSUNG ELECTRONICS CO LTD10 citations74
US6586804B2Jul 1, 2003
Shallow trench isolation type semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD10 citations74
US6303412B1Oct 16, 2001
Methods of forming semiconductor-on-insulator substrates and devices and structures formed thereby
SAMSUNG ELECTRONICS CO LTD5 citations74
US5893745AApr 13, 1999
Methods of forming semiconductor-on-insulator substrates
SAMSUNG ELECTRONICS CO LTD7 citations74
US5501995AMar 26, 1996
Method for manufacturing a gate electrode of a MOS transistor
SAMSUNG ELECTRONICS CO LTD11 citations71
US7602633B2Oct 13, 2009
Non-volatile memory device, method of manufacturing the same, and method of operating the same
SAMSUNG ELECTRONICS CO LTD3 citations63
US7449763B2Nov 11, 2008
Method of fabricating cell of nonvolatile memory device with floating gate
SAMSUNG ELECTRONICS CO LTD1 citations63
US7122426B2Oct 17, 2006
Method of fabricating cell of nonvolatile memory device with floating gate
SAMSUNG ELECTRONICS CO LTD2 citations63
US6181014B1Jan 30, 2001
Integrated circuit memory devices having highly integrated SOI memory cells therein
SAMSUNG ELECTRONICS CO LTD5 citations63
US8049269B2Nov 1, 2011
Non-volatile memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations62
US7649784B2Jan 19, 2010
Memory cell programming methods capable of reducing coupling effects
SAMSUNG ELECTRONICS CO LTD4 citations62
US7615437B2Nov 10, 2009
Non-volatile memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations62
US7344944B2Mar 18, 2008
Non-volatile memory device and fabricating method thereof
SAMSUNG ELECTRONICS CO LTD2 citations62
US7869255B2Jan 11, 2011
Non-volatile memory devices, method of manufacturing and method of operating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7577042B2Aug 18, 2009
Method of programming multi-level semiconductor memory device and multi-level semiconductor memory device
SAMSUNG ELECTRONICS CO LTD0 citations52