Inventor
CHANG SUNG-NAM
KR20 patents
⚠️ This page may combine multiple inventors who share the name “CHANG SUNG-NAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
18 patentsUS6380032B1Apr 30, 2002
Flash memory device and method of making same
SAMSUNG ELECTRONICS CO LTD63 citations95
US8362542B2Jan 29, 2013
Semiconductor devices comprising a plurality of gate structures
SAMSUNG ELECTRONICS CO LTD35 citations92
US7061044B2Jun 13, 2006
Non-volatile memory device
SAMSUNG ELECTRONICS CO LTD17 citations92
US6624464B2Sep 23, 2003
Highly integrated non-volatile memory cell array having a high program speed
SAMSUNG ELECTRONICS CO LTD38 citations92
US6515329B2Feb 4, 2003
Flash memory device and method of making same
SAMSUNG ELECTRONICS CO LTD33 citations92
US5414302AMay 9, 1995
Semiconductor device with a multilayered contact structure having a boro-phosphate silicate glass planarizing layer
SAMSUNG ELECTRONICS CO LTD29 citations92
US7508048B2Mar 24, 2009
Methods of fabricating a semiconductor device having multi-gate insulation layers and semiconductor devices fabricated thereby
SAMSUNG ELECTRONICS CO LTD12 citations84
US6482728B2Nov 19, 2002
Method for fabricating floating gate
SAMSUNG ELECTRONICS CO LTD17 citations84
US7598564B2Oct 6, 2009
Non-volatile memory devices and methods of forming non-volatile memory devices
SAMSUNG ELECTRONICS CO LTD9 citations83
US7700426B2Apr 20, 2010
Nonvolatile memory device and method of forming the same
SAMSUNG ELECTRONICS CO LTD7 citations74
US5320980AJun 14, 1994
Interconnection structure in semiconductor device and the method thereof
SAMSUNG ELECTRONICS CO LTD6 citations73
US6891222B2May 10, 2005
Non-volatile memory devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations63
US7391082B2Jun 24, 2008
Semiconductor integrated circuit having resistor
SAMSUNG ELECTRONICS CO LTD6 citations62
US7344944B2Mar 18, 2008
Non-volatile memory device and fabricating method thereof
SAMSUNG ELECTRONICS CO LTD2 citations62
US7666717B2Feb 23, 2010
Non-volatile memory devices including fuse covered field regions
SAMSUNG ELECTRONICS CO LTD2 citations61
US7541243B2Jun 2, 2009
Methods of forming integrated circuit devices having gate electrodes formed on non-uniformly thick gate insulating layers
SAMSUNG ELECTRONICS CO LTD0 citations52
US7132728B2Nov 7, 2006
Non-volatile memory devices including fuse covered field regions
SAMSUNG ELECTRONICS CO LTD0 citations51
US7736989B2Jun 15, 2010
Method of forming semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations42