P

Inventor

CHANG SUNG-NAM

KR20 patents
⚠️ This page may combine multiple inventors who share the name “CHANG SUNG-NAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

18 patents
US6380032B1Apr 30, 2002

Flash memory device and method of making same

SAMSUNG ELECTRONICS CO LTD63 citations95
US8362542B2Jan 29, 2013

Semiconductor devices comprising a plurality of gate structures

SAMSUNG ELECTRONICS CO LTD35 citations92
US7061044B2Jun 13, 2006

Non-volatile memory device

SAMSUNG ELECTRONICS CO LTD17 citations92
US6624464B2Sep 23, 2003

Highly integrated non-volatile memory cell array having a high program speed

SAMSUNG ELECTRONICS CO LTD38 citations92
US6515329B2Feb 4, 2003

Flash memory device and method of making same

SAMSUNG ELECTRONICS CO LTD33 citations92
US5414302AMay 9, 1995

Semiconductor device with a multilayered contact structure having a boro-phosphate silicate glass planarizing layer

SAMSUNG ELECTRONICS CO LTD29 citations92
US7508048B2Mar 24, 2009

Methods of fabricating a semiconductor device having multi-gate insulation layers and semiconductor devices fabricated thereby

SAMSUNG ELECTRONICS CO LTD12 citations84
US6482728B2Nov 19, 2002

Method for fabricating floating gate

SAMSUNG ELECTRONICS CO LTD17 citations84
US7598564B2Oct 6, 2009

Non-volatile memory devices and methods of forming non-volatile memory devices

SAMSUNG ELECTRONICS CO LTD9 citations83
US7700426B2Apr 20, 2010

Nonvolatile memory device and method of forming the same

SAMSUNG ELECTRONICS CO LTD7 citations74
US5320980AJun 14, 1994

Interconnection structure in semiconductor device and the method thereof

SAMSUNG ELECTRONICS CO LTD6 citations73
US6891222B2May 10, 2005

Non-volatile memory devices and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations63
US7391082B2Jun 24, 2008

Semiconductor integrated circuit having resistor

SAMSUNG ELECTRONICS CO LTD6 citations62
US7344944B2Mar 18, 2008

Non-volatile memory device and fabricating method thereof

SAMSUNG ELECTRONICS CO LTD2 citations62
US7666717B2Feb 23, 2010

Non-volatile memory devices including fuse covered field regions

SAMSUNG ELECTRONICS CO LTD2 citations61
US7541243B2Jun 2, 2009

Methods of forming integrated circuit devices having gate electrodes formed on non-uniformly thick gate insulating layers

SAMSUNG ELECTRONICS CO LTD0 citations52
US7132728B2Nov 7, 2006

Non-volatile memory devices including fuse covered field regions

SAMSUNG ELECTRONICS CO LTD0 citations51
US7736989B2Jun 15, 2010

Method of forming semiconductor device

SAMSUNG ELECTRONICS CO LTD1 citations42

KANG DAE-WOONG

1 patent

SAMSUNG ELECTRONICW CO LTD

1 patent