Inventor
MA ZHIYONG
CN10 patents
⚠️ This page may combine multiple inventors who share the name “MA ZHIYONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
7 patentsUS6878465B2Apr 12, 2005
Under bump metallurgy for Lead-Tin bump over copper pad
INTEL CORP19 citations92
US6703069B1Mar 9, 2004
Under bump metallurgy for lead-tin bump over copper pad
INTEL CORP33 citations92
US6740427B2May 25, 2004
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same
INTEL CORP13 citations81
US7679145B2Mar 16, 2010
Transistor performance enhancement using engineered strains
INTEL CORP5 citations61
US12431327B2Sep 30, 2025
Stroboscopic electron-beam signal image mapping
INTEL CORP0 citations51
US9123724B2Sep 1, 2015
Methods of forming secured metal gate antifuse structures
INTEL CORP1 citations49
US11749560B2Sep 5, 2023
Cladded metal interconnects
INTEL CORP0 citations46