Inventor
KISHIMOTO KOJI
JP25 patents
⚠️ This page may combine multiple inventors who share the name “KISHIMOTO KOJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
15 patentsUS5506177AApr 9, 1996
Fabrication process for multilevel interconnections in a semiconductor device
NEC CORP93 citations96
US6346302B2Feb 12, 2002
High density plasma enhanced chemical vapor deposition method
NEC CORP46 citations92
US6333248B1Dec 25, 2001
Method of fabricating a semiconductor device
NEC CORP48 citations92
US6294467B1Sep 25, 2001
Process for forming fine wiring
NEC CORP47 citations92
US6271119B1Aug 7, 2001
Method for making semiconductor device
NEC CORP20 citations92
US6130154AOct 10, 2000
Semiconductor device and fabrication process thereof
NEC CORP34 citations92
US6093637AJul 25, 2000
Method of making a multi-layer interconnection structure
NEC CORP25 citations92
US6057242AMay 2, 2000
Flat interlayer insulating film suitable for multi-layer wiring
NEC CORP34 citations92
US6033990AMar 7, 2000
Method for manufacturing a multilevel interconnection structure
NEC CORP46 citations92
US6005291ADec 21, 1999
Semiconductor device and process for production thereof
NEC CORP42 citations92
US5840631ANov 24, 1998
Method of manufacturing semiconductor device
NEC CORP48 citations92
US6037278AMar 14, 2000
Method of manufacturing semiconductor devices having multi-level wiring structure
NEC CORP36 citations86
US6329261B1Dec 11, 2001
Method for forming a shallow trench isolation structure
NEC CORP16 citations84
US6287956B2Sep 11, 2001
Multilevel interconnecting structure in semiconductor device and method of forming the same
NEC CORP13 citations74
US5891234AApr 6, 1999
Spin on glass material and method for forming a semiconductor device by using improved spin on glass material
NEC CORP6 citations73