Inventor
KAZIOR THOMAS E
US24 patents
⚠️ This page may combine multiple inventors who share the name “KAZIOR THOMAS E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RAYTHEON CO
20 patentsUS5343071AAug 30, 1994
Semiconductor structures having dual surface via holes
RAYTHEON CO146 citations96
US6175287B1Jan 16, 2001
Direct backside interconnect for multiple chip assemblies
RAYTHEON CO136 citations92
US7902083B2Mar 8, 2011
Passivation layer for a circuit device and method of manufacture
RAYTHEON CO15 citations91
US4970578ANov 13, 1990
Selective backside plating of GaAs monolithic microwave integrated circuits
RAYTHEON CO27 citations91
US4807022AFeb 21, 1989
Simultaneous formation of via hole and tub structures for GaAs monolithic microwave integrated circuits
RAYTHEON CO50 citations91
US4794093ADec 27, 1988
Selective backside plating of gaas monolithic microwave integrated circuits
RAYTHEON CO32 citations91
US10224285B2Mar 5, 2019
Nitride structure having gold-free contact and methods for forming such structures
RAYTHEON CO7 citations83
US10096550B2Oct 9, 2018
Nitride structure having gold-free contact and methods for forming such structures
RAYTHEON CO7 citations83
US9478508B1Oct 25, 2016
Microwave integrated circuit (MMIC) damascene electrical interconnect for microwave energy transmission
RAYTHEON CO19 citations83
US9231064B1Jan 5, 2016
Double heterojunction group III-nitride structures
RAYTHEON CO18 citations83
US7767589B2Aug 3, 2010
Passivation layer for a circuit device and method of manufacture
RAYTHEON CO13 citations82
US4927784AMay 22, 1990
Simultaneous formation of via hole and tube structures for GaAs monolithic microwave integrated circuits
RAYTHEON CO22 citations81
US4968637ANov 6, 1990
Method of manufacture TiW alignment mark and implant mask
RAYTHEON CO22 citations80
US11177216B2Nov 16, 2021
Nitride structures having low capacitance gate contacts integrated with copper damascene structures
RAYTHEON CO2 citations72
US9761445B2Sep 12, 2017
Methods and structures for forming microstrip transmission lines on thin silicon carbide on insulator (SICOI) wafers
RAYTHEON CO2 citations72
US7387958B2Jun 17, 2008
MMIC having back-side multi-layer signal routing
RAYTHEON CO7 citations71
US11784248B2Oct 10, 2023
Group III-V semiconductor structures having crystalline regrowth layers and methods for forming such structures
RAYTHEON CO0 citations62
US11515410B2Nov 29, 2022
Group III-V semiconductor structures having crystalline regrowth layers and methods for forming such structures
RAYTHEON CO1 citations62
US11239326B2Feb 1, 2022
Electrode structure for field effect transistor
RAYTHEON CO0 citations61
US10930742B2Feb 23, 2021
Wafer structure with mode suppression
RAYTHEON CO0 citations40