Inventor
O'CONNOR DANIEL P
US8 patents
⚠️ This page may combine multiple inventors who share the name “O'CONNOR DANIEL P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
5 patentsUS6136419AOct 24, 2000
Ceramic substrate having a sealed layer
IBM74 citations95
US6037044AMar 14, 2000
Direct deposit thin film single/multi chip module
IBM68 citations95
US6657130B2Dec 2, 2003
Electrical and physical design integration method and apparatus for providing interconnections on first level ceramic chip carrier packages
IBM74 citations92
US6261467B1Jul 17, 2001
Direct deposit thin film single/multi chip module
IBM26 citations91
US7085143B1Aug 1, 2006
In-module current source
IBM13 citations82