Inventor
STUDZINSKI LISA M
US5 patents
Patents
5 patentsUS6037044AMar 14, 2000
Direct deposit thin film single/multi chip module
IBM68 citations95
US6291272B1Sep 18, 2001
Structure and process for making substrate packages for high frequency application
IBM33 citations92
US6261467B1Jul 17, 2001
Direct deposit thin film single/multi chip module
IBM26 citations91
US6096565AAug 1, 2000
Multi-layer glass ceramic module with superconductor wiring
IBM14 citations72
US6002951ADec 14, 1999
Multi-layer ceramic substrate having high TC superconductor circuitry
IBM5 citations72