Inventor

SUZUKI MIEKO

JP15 patents

⚠️ This page may combine multiple inventors who share the name “SUZUKI MIEKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEC CORP

9 patents

US5420075AMay 30, 1995

Forming multi-layered interconnections with fluorine compound treatment permitting selective deposition of insulator

NEC CORP293 citations98

US6361708B1Mar 26, 2002

Method and apparatus for polishing a metal film

NEC CORP22 citations92

US5607880AMar 4, 1997

Method of fabricating multilevel interconnections in a semiconductor integrated circuit

NEC CORP40 citations92

US5491108AFeb 13, 1996

Method of producing semiconductor integrated circuit device having interplayer insulating film covering substrate

NEC CORP20 citations92

US5332694AJul 26, 1994

Process for manufacturing a semiconductor device

NEC CORP27 citations92

US6235071B1May 22, 2001

Chemical mechanical polishing method for highly accurate in-plane uniformity in polishing rate over position

NEC CORP14 citations73

US6054383AApr 25, 2000

NEC ELECTRONICS CORP

3 patents

US6783446B1Aug 31, 2004

Chemical mechanical polishing apparatus and method of chemical mechanical polishing

NEC ELECTRONICS CORP6 citations73

US6551914B1Apr 22, 2003

Method of forming polish stop by plasma treatment for interconnection

NEC ELECTRONICS CORP11 citations73

US6951512B2Oct 4, 2005

Chemical mechanical polishing apparatus and method of chemical mechanical polishing

NEC ELECTRONICS CORP1 citations51

SONY CORP

2 patents

US7123336B2Oct 17, 2006

Twisted nematic liquid crystal material with certain values for dielectric constant anisotropy, twisted elasticity modulus and refractive index anisotropy

SONY CORP2 citations61

US7167229B2Jan 23, 2007

Liquid crystal display element and projection display device

SONY CORP0 citations50

JAPAN ATOMIC ENERGY RES INST

1 patent

US4552633ANov 12, 1985

Fine particulate for use in clinical testing and a process for producing thereof

JAPAN ATOMIC ENERGY RES INST26 citations82

SUZUKI MIEKO

NEC CORP

Forming multi-layered interconnections with fluorine compound treatment permitting selective deposition of insulator

Method and apparatus for polishing a metal film

Method of fabricating multilevel interconnections in a semiconductor integrated circuit

Method of producing semiconductor integrated circuit device having interplayer insulating film covering substrate

Process for manufacturing a semiconductor device

Chemical mechanical polishing method for highly accurate in-plane uniformity in polishing rate over position

Fabrication method of semiconductor device

Fabrication process of semiconductor device

Method and apparatus polishing wafer for extended effective area of wafer

NEC ELECTRONICS CORP

Chemical mechanical polishing apparatus and method of chemical mechanical polishing

Method of forming polish stop by plasma treatment for interconnection

Chemical mechanical polishing apparatus and method of chemical mechanical polishing

SONY CORP

Twisted nematic liquid crystal material with certain values for dielectric constant anisotropy, twisted elasticity modulus and refractive index anisotropy

Liquid crystal display element and projection display device

JAPAN ATOMIC ENERGY RES INST

Fine particulate for use in clinical testing and a process for producing thereof