Inventor
GOPALRAJA PRABURAM
US75 patents
⚠️ This page may combine multiple inventors who share the name “GOPALRAJA PRABURAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
45 patentsUS6784096B2Aug 31, 2004
Methods and apparatus for forming barrier layers in high aspect ratio vias
APPLIED MATERIALS INC137 citations99
US6451177B1Sep 17, 2002
Vault shaped target and magnetron operable in two sputtering modes
APPLIED MATERIALS INC103 citations99
US6444104B2Sep 3, 2002
Sputtering target having an annular vault
APPLIED MATERIALS INC85 citations99
US6436251B2Aug 20, 2002
Vault-shaped target and magnetron having both distributed and localized magnets
APPLIED MATERIALS INC89 citations99
US6413382B1Jul 2, 2002
Pulsed sputtering with a small rotating magnetron
APPLIED MATERIALS INC171 citations99
US6350353B2Feb 26, 2002
Alternate steps of IMP and sputtering process to improve sidewall coverage
APPLIED MATERIALS INC175 citations99
US6344419B1Feb 5, 2002
Pulsed-mode RF bias for sidewall coverage improvement
APPLIED MATERIALS INC180 citations99
US6306265B1Oct 23, 2001
High-density plasma for ionized metal deposition capable of exciting a plasma wave
APPLIED MATERIALS INC138 citations99
US6251242B1Jun 26, 2001
Magnetron and target producing an extended plasma region in a sputter reactor
APPLIED MATERIALS INC287 citations99
US6358376B1Mar 19, 2002
Biased shield in a magnetron sputter reactor
APPLIED MATERIALS INC81 citations98
US6277249B1Aug 21, 2001
Integrated process for copper via filling using a magnetron and target producing highly energetic ions
APPLIED MATERIALS INC273 citations98
US6274008B1Aug 14, 2001
Integrated process for copper via filling
APPLIED MATERIALS INC231 citations98
US6193855B1Feb 27, 2001
Use of modulated inductive power and bias power to reduce overhang and improve bottom coverage
APPLIED MATERIALS INC125 citations98
US6221221B1Apr 24, 2001
Apparatus for providing RF return current path control in a semiconductor wafer processing system
APPLIED MATERIALS INC154 citations97
US6143140ANov 7, 2000
Method and apparatus to improve the side wall and bottom coverage in IMP process by using magnetic field
APPLIED MATERIALS INC99 citations97
US7504006B2Mar 17, 2009
Self-ionized and capacitively-coupled plasma for sputtering and resputtering
APPLIED MATERIALS INC49 citations96
US7253109B2Aug 7, 2007
Method of depositing a tantalum nitride/tantalum diffusion barrier layer system
APPLIED MATERIALS INC44 citations96
US6991709B2Jan 31, 2006
Multi-step magnetron sputtering process
APPLIED MATERIALS INC46 citations96
US6974771B2Dec 13, 2005
Methods and apparatus for forming barrier layers in high aspect ratio vias
APPLIED MATERIALS INC46 citations96
US6911124B2Jun 28, 2005
Method of depositing a TaN seed layer
APPLIED MATERIALS INC52 citations96
US6787006B2Sep 7, 2004
Operating a magnetron sputter reactor in two modes
APPLIED MATERIALS INC53 citations96
US6730196B2May 4, 2004
Auxiliary electromagnets in a magnetron sputter reactor
APPLIED MATERIALS INC56 citations96
US6673724B2Jan 6, 2004
Pulsed-mode RF bias for side-wall coverage improvement
APPLIED MATERIALS INC49 citations96
US6485618B2Nov 26, 2002
Integrated copper fill process
APPLIED MATERIALS INC47 citations96
US6406599B1Jun 18, 2002
Magnetron with a rotating center magnet for a vault shaped sputtering target
APPLIED MATERIALS INC45 citations96
US6368469B1Apr 9, 2002
Coils for generating a plasma and for sputtering
APPLIED MATERIALS INC48 citations96
US6042700AMar 28, 2000
Adjustment of deposition uniformity in an inductively coupled plasma source
APPLIED MATERIALS INC77 citations96
US6254738B1Jul 3, 2001
Use of variable impedance having rotating core to control coil sputter distribution
APPLIED MATERIALS INC61 citations95
US6837975B2Jan 4, 2005
Asymmetric rotating sidewall magnet ring for magnetron sputtering
APPLIED MATERIALS INC19 citations93
US6824658B2Nov 30, 2004
Partial turn coil for generating a plasma
APPLIED MATERIALS INC25 citations93
US6790323B2Sep 14, 2004
Self ionized sputtering using a high density plasma source
APPLIED MATERIALS INC22 citations93
US6709553B2Mar 23, 2004
Multiple-step sputter deposition
APPLIED MATERIALS INC24 citations93
US6660134B1Dec 9, 2003
Feedthrough overlap coil
APPLIED MATERIALS INC29 citations93
US6485617B2Nov 26, 2002
Sputtering method utilizing an extended plasma region
APPLIED MATERIALS INC37 citations93
US6461483B1Oct 8, 2002
Method and apparatus for performing high pressure physical vapor deposition
APPLIED MATERIALS INC35 citations93
US7737028B2Jun 15, 2010
Selective ruthenium deposition on copper materials
APPLIED MATERIALS INC21 citations92
US6783639B2Aug 31, 2004
Coils for generating a plasma and for sputtering
APPLIED MATERIALS INC21 citations92
US6723214B2Apr 20, 2004
Apparatus for improved power coupling through a workpiece in a semiconductor wafer processing system
APPLIED MATERIALS INC22 citations90
US9548201B2Jan 17, 2017
Self-aligned multiple spacer patterning schemes for advanced nanometer technology
APPLIED MATERIALS INC6 citations84
US6758949B2Jul 6, 2004
Magnetically confined metal plasma sputter source with magnetic control of ion and neutral densities
APPLIED MATERIALS INC20 citations84
US6235169B1May 22, 2001
Modulated power for ionized metal plasma deposition
APPLIED MATERIALS INC17 citations84
US6146508ANov 14, 2000
Sputtering method and apparatus with small diameter RF coil
APPLIED MATERIALS INC16 citations84
US7704887B2Apr 27, 2010
Remote plasma pre-clean with low hydrogen pressure
APPLIED MATERIALS INC10 citations83
US7686926B2Mar 30, 2010
Multi-step process for forming a metal barrier in a sputter reactor
APPLIED MATERIALS INC16 citations83
US7163607B2Jan 16, 2007
Process kit for improved power coupling through a workpiece in a semiconductor wafer processing system
APPLIED MATERIALS INC10 citations82
DING PEIJUN
2 patentsGOPALRAJA PRABURAM
1 patentNULMAN JAIM
1 patentGUNG TZA-JING
1 patentShowing the top 50 of 75 patents by PatentIndex Score.