Inventor
CHOI KANG RIM
US16 patents
⚠️ This page may combine multiple inventors who share the name “CHOI KANG RIM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IXYS CORP
10 patentsUS6731002B2May 4, 2004
High frequency power device with a plastic molded package and direct bonded substrate
IXYS CORP68 citations95
US7005734B2Feb 28, 2006
Double-sided cooling isolated packaged power semiconductor device
IXYS CORP28 citations92
US6727585B2Apr 27, 2004
Power device with a plastic molded package and direct bonded substrate
IXYS CORP20 citations92
US6710463B2Mar 23, 2004
Electrically isolated power semiconductor package
IXYS CORP16 citations92
US6583505B2Jun 24, 2003
Electrically isolated power device package
IXYS CORP20 citations92
US9842795B2Dec 12, 2017
Lead and lead frame for power package
IXYS CORP2 citations73
US6534343B2Mar 18, 2003
Method of making electrically isolated power semiconductor package
IXYS CORP11 citations73
US7459659B2Dec 2, 2008
Induction heating circuit and winding method for heating coils
IXYS CORP2 citations62
US8901723B2Dec 2, 2014
Electrically isolated power semiconductor package with optimized layout
IXYS CORP2 citations60
US9177888B2Nov 3, 2015
Electrically isolated power semiconductor package with optimized layout
IXYS CORP0 citations49