P

Inventor

LEE JAE-IL

KR44 patents
⚠️ This page may combine multiple inventors who share the name “LEE JAE-IL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

23 patents
US6489790B1Dec 3, 2002

Socket including pressure conductive rubber and mesh for testing of ball grid array package

SAMSUNG ELECTRONICS CO LTD39 citations92
US9747170B2Aug 29, 2017

Non-volatile multi-level cell memory system and method of performing adaptive data back-up in the system

SAMSUNG ELECTRONICS CO LTD8 citations84
US7772828B2Aug 10, 2010

Automatic test equipment capable of high speed test

SAMSUNG ELECTRONICS CO LTD11 citations83
US7838790B2Nov 23, 2010

Multifunctional handler system for electrical testing of semiconductor devices

SAMSUNG ELECTRONICS CO LTD11 citations82
US7554349B2Jun 30, 2009

Handlers for testing semiconductor devices that are capable of maintaining stable temperature in test environments

SAMSUNG ELECTRONICS CO LTD16 citations82
US7084655B2Aug 1, 2006

Burn-in test apparatus for BGA packages using forced heat exhaust

SAMSUNG ELECTRONICS CO LTD15 citations82
US9902758B2Feb 27, 2018

Three-helix bundle protein and use thereof

SAMSUNG ELECTRONICS CO LTD10 citations81
US7438563B2Oct 21, 2008

Connector for testing a semiconductor package

SAMSUNG ELECTRONICS CO LTD9 citations80
US9617344B2Apr 11, 2017

Fusion protein comprising targeting moiety, cleavage site, and cell membrane penetrating domain, and use thereof

SAMSUNG ELECTRONICS CO LTD2 citations70
US9879081B2Jan 30, 2018

Protein complex, bispecific antibody including the protein complex, and method of preparation thereof

SAMSUNG ELECTRONICS CO LTD2 citations66
US6841425B2Jan 11, 2005

Wafer treatment method for protecting fuse box of semiconductor chip

SAMSUNG ELECTRONICS CO LTD3 citations60
US6396294B2May 28, 2002

Socket pin and socket for electrical testing of semiconductor packages

SAMSUNG ELECTRONICS CO LTD6 citations60
US9285371B2Mar 15, 2016

Method of screening antibodies with high antigen selectivity

SAMSUNG ELECTRONICS CO LTD1 citations52
US9573985B2Feb 21, 2017

p16 protein variant and use thereof for preventing or treating cancer

SAMSUNG ELECTRONICS CO LTD0 citations51
US9512193B2Dec 6, 2016

P15 protein variant and use thereof for preventing or treating cancer

SAMSUNG ELECTRONICS CO LTD0 citations51
US8911954B2Dec 16, 2014

Polypeptide linker and method of analyzing target material using the same

SAMSUNG ELECTRONICS CO LTD0 citations49
US9365833B2Jun 14, 2016

Leucine zipper variant and use thereof

SAMSUNG ELECTRONICS CO LTD0 citations47
US9777072B2Oct 3, 2017

Protein complex and method of preparing same

SAMSUNG ELECTRONICS CO LTD0 citations46
US9522952B2Dec 20, 2016

Polypeptide binding to annexin A1 and use thereof

SAMSUNG ELECTRONICS CO LTD0 citations46
US9470677B2Oct 18, 2016

Cell with surface coated with ANXA1 and use thereof

SAMSUNG ELECTRONICS CO LTD0 citations45
US9522961B2Dec 20, 2016

Protein complexes and methods of manufacturing bispecific antibodies using the protein complexes

SAMSUNG ELECTRONICS CO LTD0 citations39
US10159690B2Dec 25, 2018

Chemically modified targeting protein and use thereof

SAMSUNG ELECTRONICS CO LTD0 citations38
US9724378B2Aug 8, 2017

Fusion protein comprising granzyme B and use thereof

SAMSUNG ELECTRONICS CO LTD0 citations38

SK HYNIX INC

6 patents

LEE JAE-IL

4 patents

AREUMDAWOON COSMETICS CO LTD

2 patents

LEE SANG JONG

2 patents

HYUNDAI MOTOR COMPANY LTD

1 patent

CMG PHARMACEUTICAL CO LTD

1 patent

CHOI WOON-SUP

1 patent

CHOI IN-HO

1 patent

KAKAO CORP

1 patent

MJVISIONTECH CO LTD

1 patent

SONG KI-JAE

1 patent