Inventor
KATOGI SHIGEKI
JP24 patents
⚠️ This page may combine multiple inventors who share the name “KATOGI SHIGEKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
8 patentsUS7851131B2Dec 14, 2010
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
HITACHI CHEMICAL CO LTD13 citations92
US8373283B2Feb 12, 2013
Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device
HITACHI CHEMICAL CO LTD13 citations84
US5811218ASep 22, 1998
Photoinitiator compositions including amino acids, coumarin and titanocene and photosensitive materials using the same
HITACHI CHEMICAL CO LTD17 citations83
US10175577B2Jan 8, 2019
Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component
HITACHI CHEMICAL CO LTD4 citations70
US7576141B2Aug 18, 2009
Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
HITACHI CHEMICAL CO LTD2 citations58
US8349700B2Jan 8, 2013
Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device
HITACHI CHEMICAL CO LTD0 citations51
US9395626B2Jul 19, 2016
Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component
HITACHI CHEMICAL CO LTD0 citations48
US7795325B2Sep 14, 2010
Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
HITACHI CHEMICAL CO LTD0 citations48
KAWAMORI TAKASHI
5 patentsUS8445177B2May 21, 2013
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
KAWAMORI TAKASHI2 citations61
US8323873B2Dec 4, 2012
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
KAWAMORI TAKASHI2 citations61
US8293453B2Oct 23, 2012
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
KAWAMORI TAKASHI2 citations61
US8673539B2Mar 18, 2014
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
KAWAMORI TAKASHI0 citations51
US8278024B2Oct 2, 2012
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
KAWAMORI TAKASHI0 citations51
KATOGI SHIGEKI
4 patentsUS8518303B2Aug 27, 2013
Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
KATOGI SHIGEKI2 citations59
US8138268B2Mar 20, 2012
Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
KATOGI SHIGEKI2 citations58
US8696942B2Apr 15, 2014
Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
KATOGI SHIGEKI0 citations49
US8309658B2Nov 13, 2012
Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
KATOGI SHIGEKI0 citations48
MASUKO TAKASHI
3 patentsUS8258017B2Sep 4, 2012
Photosensitive adhesive
MASUKO TAKASHI12 citations82
US8293847B2Oct 23, 2012
Film-like adhesive, adhesive sheet, and semiconductor device using same
MASUKO TAKASHI2 citations60
US8507323B2Aug 13, 2013
Method of producing semiconductor device with patterned photosensitive adhesive
MASUKO TAKASHI0 citations50