Inventor
TSENG CHEN WEI
US8 patents
⚠️ This page may combine multiple inventors who share the name “TSENG CHEN WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XILINX INC
4 patentsUS7576557B1Aug 18, 2009
Method and apparatus for mitigating one or more event upsets
XILINX INC68 citations96
US7589558B1Sep 15, 2009
Method and apparatus for configuring an integrated circuit
XILINX INC25 citations91
US7650585B1Jan 19, 2010
Implementing a user design in a programmable logic device with single event upset mitigation
XILINX INC15 citations82
US7626415B1Dec 1, 2009
Method and apparatus for configuring an integrated circuit
XILINX INC7 citations72
UNIMICRON TECHNOLOGY CORP
3 patentsUS10497847B2Dec 3, 2019
Structure and manufacturing method of heat dissipation substrate and package structure and method thereof
UNIMICRON TECHNOLOGY CORP2 citations70
US10056356B1Aug 21, 2018
Chip package circuit board module
UNIMICRON TECHNOLOGY CORP5 citations70
US10159151B1Dec 18, 2018
Chip package circuit board module
UNIMICRON TECHNOLOGY CORP1 citations48