Inventor

LYTLE WILLIAM H

US28 patents

⚠️ This page may combine multiple inventors who share the name “LYTLE WILLIAM H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LYTLE WILLIAM H

FREESCALE SEMICONDUCTOR INC

Method of packaging an integrated circuit die

Integrated circuit package formation

Flexible carrier and release method for high volume electronic package fabrication

Wafer level MEMS packaging

Activation plate for electroless and immersion plating of integrated circuits

Corrosion-resistant copper bond pad and integrated device

Method for forming a packaged semiconductor device

Flexible carrier for high volume electronic package fabrication

Warp compensated electronic assemblies

Low cost fabrication and assembly of lid for semiconductor devices

Electronic assembly manufacturing method

Method of forming a package with exposed component surfaces

MOTOROLA INC

Bonding structure for an electronic device

Adjustable plating cell for uniform bump plating of semiconductor wafers

Method of forming an electrical interconnect

Method of forming contact pads for wafer level testing and burn-in of semiconductor dice

Interconnect system for a semiconductor chip and a substrate

Electroless plating of portions of semiconductor devices and the like

Method of chemically etching TiW and/or TiWN

Method of forming an electrically conductive polymer bump over an aluminum electrode

Device for solder removal

Backside metallization scheme for semiconductor devices

Apparatus and method for cold cross-sectioning of soft materials

Method of etching copper layers

XU JIANWEN

Method for releasing a microelectronic assembly from a carrier substrate

LYTLE WILLIAM H

Warp compensated package and method

GAO WEI

Method for singulating electronic components from a substrate

BURCH KENNETH R

Method of forming a semiconductor package including two devices