Inventor
YOUN SUN-PIL
KR35 patents
⚠️ This page may combine multiple inventors who share the name “YOUN SUN-PIL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
26 patentsUS7704788B2Apr 27, 2010
Methods of fabricating multi-bit phase-change memory devices and devices formed thereby
SAMSUNG ELECTRONICS CO LTD68 citations95
US9343432B2May 17, 2016
Semiconductor chip stack having improved encapsulation
SAMSUNG ELECTRONICS CO LTD23 citations92
US8901749B2Dec 2, 2014
Semiconductor packages and electronic systems including the same
SAMSUNG ELECTRONICS CO LTD29 citations92
US7084061B2Aug 1, 2006
Methods of fabricating a semiconductor device having MOS transistor with strained channel
SAMSUNG ELECTRONICS CO LTD36 citations92
US7629677B2Dec 8, 2009
Semiconductor package with inner leads exposed from an encapsulant
SAMSUNG ELECTRONICS CO LTD26 citations90
US7696552B2Apr 13, 2010
Semiconductor devices including high-k dielectric materials
SAMSUNG ELECTRONICS CO LTD12 citations84
US7521316B2Apr 21, 2009
Methods of forming gate structures for semiconductor devices
SAMSUNG ELECTRONICS CO LTD8 citations84
US7371669B2May 13, 2008
Method of forming a gate of a semiconductor device
SAMSUNG ELECTRONICS CO LTD7 citations74
US6797559B2Sep 28, 2004
Method of fabricating semiconductor device having metal conducting layer
SAMSUNG ELECTRONICS CO LTD10 citations74
US8809888B2Aug 19, 2014
Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device
SAMSUNG ELECTRONICS CO LTD4 citations73
US7544996B2Jun 9, 2009
Methods of fabricating a semiconductor device having a metal gate pattern
SAMSUNG ELECTRONICS CO LTD4 citations73
US7232756B2Jun 19, 2007
Nickel salicide process with reduced dopant deactivation
SAMSUNG ELECTRONICS CO LTD9 citations73
US9184156B2Nov 10, 2015
Semiconductor packages and electronic systems including the same
SAMSUNG ELECTRONICS CO LTD2 citations63
US8034701B2Oct 11, 2011
Methods of forming recessed gate electrodes having covered layer interfaces
SAMSUNG ELECTRONICS CO LTD3 citations63
US7875939B2Jan 25, 2011
Semiconductor device including an ohmic layer
SAMSUNG ELECTRONICS CO LTD2 citations63
US7772637B2Aug 10, 2010
Semiconductor devices including gate structures and leakage barrier oxides
SAMSUNG ELECTRONICS CO LTD3 citations63
US7582931B2Sep 1, 2009
Recessed gate electrodes having covered layer interfaces and methods of forming the same
SAMSUNG ELECTRONICS CO LTD3 citations63
US7544597B2Jun 9, 2009
Method of forming a semiconductor device including an ohmic layer
SAMSUNG ELECTRONICS CO LTD3 citations63
US7465617B2Dec 16, 2008
Method of fabricating a semiconductor device having a silicon oxide layer, a method of fabricating a semiconductor device having dual spacers, a method of forming a silicon oxide layer on a substrate, and a method of forming dual spacers on a conductive material layer
SAMSUNG ELECTRONICS CO LTD4 citations62
US7306996B2Dec 11, 2007
Methods of fabricating a semiconductor device having a metal gate pattern
SAMSUNG ELECTRONICS CO LTD2 citations62
US7005367B2Feb 28, 2006
Method of fabricating a semiconductor device having a silicon oxide layer, a method of fabricating a semiconductor device having dual spacers, a method of forming a silicon oxide layer on a substrate, and a method of forming dual spacers on a conductive material layer
SAMSUNG ELECTRONICS CO LTD2 citations62
US7777272B2Aug 17, 2010
Non-volatile memory device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD3 citations60
US9269877B2Feb 23, 2016
Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method
SAMSUNG ELECTRONICS CO LTD0 citations52
US7772643B2Aug 10, 2010
Methods of fabricating semiconductor device having a metal gate pattern
SAMSUNG ELECTRONICS CO LTD0 citations52
US6864132B2Mar 8, 2005
Methods of fabricating integrated circuit gates by pretreating prior to oxidizing
SAMSUNG ELECTRONICS CO LTD0 citations51
US7098123B2Aug 29, 2006
Methods of forming a semiconductor device having a metal gate electrode and associated devices
SAMSUNG ELECTRONICS CO LTD0 citations50
KIM YU-SIK
4 patentsUS8178424B2May 15, 2012
Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method
KIM YU-SIK5 citations74
US8415181B2Apr 9, 2013
Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device
KIM YU-SIK2 citations63
US8110843B2Feb 7, 2012
Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device
KIM YU-SIK1 citations63
US8637881B2Jan 28, 2014
Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method
KIM YU-SIK0 citations52