P

Inventor

YOUN SUN-PIL

KR35 patents
⚠️ This page may combine multiple inventors who share the name “YOUN SUN-PIL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

26 patents
US7704788B2Apr 27, 2010

Methods of fabricating multi-bit phase-change memory devices and devices formed thereby

SAMSUNG ELECTRONICS CO LTD68 citations95
US9343432B2May 17, 2016

Semiconductor chip stack having improved encapsulation

SAMSUNG ELECTRONICS CO LTD23 citations92
US8901749B2Dec 2, 2014

Semiconductor packages and electronic systems including the same

SAMSUNG ELECTRONICS CO LTD29 citations92
US7084061B2Aug 1, 2006

Methods of fabricating a semiconductor device having MOS transistor with strained channel

SAMSUNG ELECTRONICS CO LTD36 citations92
US7629677B2Dec 8, 2009

Semiconductor package with inner leads exposed from an encapsulant

SAMSUNG ELECTRONICS CO LTD26 citations90
US7696552B2Apr 13, 2010

Semiconductor devices including high-k dielectric materials

SAMSUNG ELECTRONICS CO LTD12 citations84
US7521316B2Apr 21, 2009

Methods of forming gate structures for semiconductor devices

SAMSUNG ELECTRONICS CO LTD8 citations84
US7371669B2May 13, 2008

Method of forming a gate of a semiconductor device

SAMSUNG ELECTRONICS CO LTD7 citations74
US6797559B2Sep 28, 2004

Method of fabricating semiconductor device having metal conducting layer

SAMSUNG ELECTRONICS CO LTD10 citations74
US8809888B2Aug 19, 2014

Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device

SAMSUNG ELECTRONICS CO LTD4 citations73
US7544996B2Jun 9, 2009

Methods of fabricating a semiconductor device having a metal gate pattern

SAMSUNG ELECTRONICS CO LTD4 citations73
US7232756B2Jun 19, 2007

Nickel salicide process with reduced dopant deactivation

SAMSUNG ELECTRONICS CO LTD9 citations73
US9184156B2Nov 10, 2015

Semiconductor packages and electronic systems including the same

SAMSUNG ELECTRONICS CO LTD2 citations63
US8034701B2Oct 11, 2011

Methods of forming recessed gate electrodes having covered layer interfaces

SAMSUNG ELECTRONICS CO LTD3 citations63
US7875939B2Jan 25, 2011

Semiconductor device including an ohmic layer

SAMSUNG ELECTRONICS CO LTD2 citations63
US7772637B2Aug 10, 2010

Semiconductor devices including gate structures and leakage barrier oxides

SAMSUNG ELECTRONICS CO LTD3 citations63
US7582931B2Sep 1, 2009

Recessed gate electrodes having covered layer interfaces and methods of forming the same

SAMSUNG ELECTRONICS CO LTD3 citations63
US7544597B2Jun 9, 2009

Method of forming a semiconductor device including an ohmic layer

SAMSUNG ELECTRONICS CO LTD3 citations63
US7465617B2Dec 16, 2008

Method of fabricating a semiconductor device having a silicon oxide layer, a method of fabricating a semiconductor device having dual spacers, a method of forming a silicon oxide layer on a substrate, and a method of forming dual spacers on a conductive material layer

SAMSUNG ELECTRONICS CO LTD4 citations62
US7306996B2Dec 11, 2007

Methods of fabricating a semiconductor device having a metal gate pattern

SAMSUNG ELECTRONICS CO LTD2 citations62
US7005367B2Feb 28, 2006

Method of fabricating a semiconductor device having a silicon oxide layer, a method of fabricating a semiconductor device having dual spacers, a method of forming a silicon oxide layer on a substrate, and a method of forming dual spacers on a conductive material layer

SAMSUNG ELECTRONICS CO LTD2 citations62
US7777272B2Aug 17, 2010

Non-volatile memory device and semiconductor package including the same

SAMSUNG ELECTRONICS CO LTD3 citations60
US9269877B2Feb 23, 2016

Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method

SAMSUNG ELECTRONICS CO LTD0 citations52
US7772643B2Aug 10, 2010

Methods of fabricating semiconductor device having a metal gate pattern

SAMSUNG ELECTRONICS CO LTD0 citations52
US6864132B2Mar 8, 2005

Methods of fabricating integrated circuit gates by pretreating prior to oxidizing

SAMSUNG ELECTRONICS CO LTD0 citations51
US7098123B2Aug 29, 2006

Methods of forming a semiconductor device having a metal gate electrode and associated devices

SAMSUNG ELECTRONICS CO LTD0 citations50

KIM YU-SIK

4 patents

LEE CHUNG-SUN

1 patent

SAMSUNG ELECTRONICS LTD CO

1 patent

KIM HYUN-JIN

1 patent

KIM KIL-SOO

1 patent

LEE SEUNG-JAE

1 patent