Inventor
MUNIANDY KESVAKUMAR V C
MY10 patents
⚠️ This page may combine multiple inventors who share the name “MUNIANDY KESVAKUMAR V C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MUNIANDY KESVAKUMAR V C
5 patentsUS9064718B1Jun 23, 2015
Pre-formed via array for integrated circuit package
MUNIANDY KESVAKUMAR V C37 citations92
US8669140B1Mar 11, 2014
Method of forming stacked die package using redistributed chip packaging
MUNIANDY KESVAKUMAR V C51 citations92
US8772913B1Jul 8, 2014
Stiffened semiconductor die package
MUNIANDY KESVAKUMAR V C14 citations82
US8945989B2Feb 3, 2015
Stiffened semiconductor die package
MUNIANDY KESVAKUMAR V C2 citations60
US8853058B2Oct 7, 2014
Method of making surface mount stacked semiconductor devices
MUNIANDY KESVAKUMAR V C0 citations40
KALANDAR NAVAS KHAN ORATTI
3 patentsUS9034694B1May 19, 2015
Embedded die ball grid array package
KALANDAR NAVAS KHAN ORATTI9 citations82
US9299675B2Mar 29, 2016
Embedded die ball grid array package
KALANDAR NAVAS KHAN ORATTI0 citations50
US8810020B2Aug 19, 2014
Semiconductor device with redistributed contacts
KALANDAR NAVAS KHAN ORATTI0 citations37