Inventor

LEE REN-DOU

TW21 patents

⚠️ This page may combine multiple inventors who share the name “LEE REN-DOU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE REN-DOU

TAIWAN SEMICONDUCTOR MFG CO LTD

Rough anti-stiction layer for MEMS device

Rough anti-stiction layer for MEMS device

Methods for wafer bonding

Shiftless wafer blades

Shiftless wafer blades

MEMS package with roughend interface

Methods for wafer bonding

Chemical mechanical planarization membrane

Chemical mechanical planarization membrane

Shiftless wafer blades

Multi-layer sealing film for high seal yield

Rough anti-stiction layer for MEMS device

MEMS package with roughend interface

MEMS structure, cap substrate and method of fabricating the same

Semiconductor package structure, alignment structure, and alignment method

Ion generator and method for using the same

Multi-layered windows for use in chemical-mechanical planarization systems

Multi-layer sealing film for high seal yield

Multi-layer sealing film for high seal yield

TAIWAN SEMICONDUCTOR MFG

Silicon nitride furnace tube low temperature cycle purge for attenuated particle formation

CHUEH CHIA-LIANG

Sputtering target with reverse erosion profile surface and sputtering system and method using the same