Inventor
HUANG YU-HUA
TW36 patents
⚠️ This page may combine multiple inventors who share the name “HUANG YU-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEDIATEK INC
22 patentsUS9640489B2May 2, 2017
Seal ring structure with capacitor
MEDIATEK INC7 citations84
US9543232B2Jan 10, 2017
Semiconductor package structure and method for forming the same
MEDIATEK INC4 citations84
US9257392B2Feb 9, 2016
Semiconductor package with through silicon via interconnect
MEDIATEK INC7 citations84
US9570399B2Feb 14, 2017
Semiconductor package assembly with through silicon via interconnect
MEDIATEK INC9 citations82
US10727202B2Jul 28, 2020
Package structure
MEDIATEK INC1 citations73
US9269664B2Feb 23, 2016
Semiconductor package with through silicon via interconnect and method for fabricating the same
MEDIATEK INC6 citations73
US9524948B2Dec 20, 2016
Package structure
MEDIATEK INC1 citations63
US11424204B2Aug 23, 2022
Semiconductor component and manufacturing method thereof
MEDIATEK INC0 citations62
US11348900B2May 31, 2022
Package structure
MEDIATEK INC0 citations62
US8987851B2Mar 24, 2015
Radio-frequency device package and method for fabricating the same
MEDIATEK INC1 citations62
US11736998B2Aug 22, 2023
Method for preventing an inter-rat change from being triggered and communications apparatus utilizing the same
MEDIATEK INC0 citations59
US11140593B2Oct 5, 2021
Method for preventing an inter-RAT change from being triggered and communications apparatus utilizing the same
MEDIATEK INC0 citations59
US9899261B2Feb 20, 2018
Semiconductor package structure and method for forming the same
MEDIATEK INC0 citations52
US9870980B2Jan 16, 2018
Semiconductor package with through silicon via interconnect
MEDIATEK INC1 citations52
US9786560B2Oct 10, 2017
Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the same
MEDIATEK INC0 citations52
US9607894B2Mar 28, 2017
Radio-frequency device package and method for fabricating the same
MEDIATEK INC0 citations52
US9425098B2Aug 23, 2016
Radio-frequency device package and method for fabricating the same
MEDIATEK INC0 citations52
US11582822B2Feb 14, 2023
Apparatuses and methods for coordinating operations associated with multiple subscriber identities
MEDIATEK INC0 citations50
US9947624B2Apr 17, 2018
Semiconductor package assembly with through silicon via interconnect
MEDIATEK INC0 citations50
US12218850B2Feb 4, 2025
Transmission rate management method and device
MEDIATEK INC0 citations48
US11805054B1Oct 31, 2023
Method and electronic device for saving power applied to a router
MEDIATEK INC0 citations43
US9859192B2Jan 2, 2018
Semiconductor structure with through-silicon via
MEDIATEK INC0 citations42
MEDIATEK SINGAPORE PTE LTD
3 patentsUS10170435B2Jan 1, 2019
Guard ring structure and method for forming the same
MEDIATEK SINGAPORE PTE LTD1 citations72
US9947627B2Apr 17, 2018
Guard ring structure and method for forming the same
MEDIATEK SINGAPORE PTE LTD1 citations61
US9397032B2Jul 19, 2016
Guard ring structure and method for forming the same
MEDIATEK SINGAPORE PTE LTD1 citations61