P

Inventor

HUANG YU-HUA

TW36 patents
⚠️ This page may combine multiple inventors who share the name “HUANG YU-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MEDIATEK INC

22 patents
US9640489B2May 2, 2017

Seal ring structure with capacitor

MEDIATEK INC7 citations84
US9543232B2Jan 10, 2017

Semiconductor package structure and method for forming the same

MEDIATEK INC4 citations84
US9257392B2Feb 9, 2016

Semiconductor package with through silicon via interconnect

MEDIATEK INC7 citations84
US9570399B2Feb 14, 2017

Semiconductor package assembly with through silicon via interconnect

MEDIATEK INC9 citations82
US10727202B2Jul 28, 2020

Package structure

MEDIATEK INC1 citations73
US9269664B2Feb 23, 2016

Semiconductor package with through silicon via interconnect and method for fabricating the same

MEDIATEK INC6 citations73
US9524948B2Dec 20, 2016

Package structure

MEDIATEK INC1 citations63
US11424204B2Aug 23, 2022

Semiconductor component and manufacturing method thereof

MEDIATEK INC0 citations62
US11348900B2May 31, 2022

Package structure

MEDIATEK INC0 citations62
US8987851B2Mar 24, 2015

Radio-frequency device package and method for fabricating the same

MEDIATEK INC1 citations62
US11736998B2Aug 22, 2023

Method for preventing an inter-rat change from being triggered and communications apparatus utilizing the same

MEDIATEK INC0 citations59
US11140593B2Oct 5, 2021

Method for preventing an inter-RAT change from being triggered and communications apparatus utilizing the same

MEDIATEK INC0 citations59
US9899261B2Feb 20, 2018

Semiconductor package structure and method for forming the same

MEDIATEK INC0 citations52
US9870980B2Jan 16, 2018

Semiconductor package with through silicon via interconnect

MEDIATEK INC1 citations52
US9786560B2Oct 10, 2017

Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the same

MEDIATEK INC0 citations52
US9607894B2Mar 28, 2017

Radio-frequency device package and method for fabricating the same

MEDIATEK INC0 citations52
US9425098B2Aug 23, 2016

Radio-frequency device package and method for fabricating the same

MEDIATEK INC0 citations52
US11582822B2Feb 14, 2023

Apparatuses and methods for coordinating operations associated with multiple subscriber identities

MEDIATEK INC0 citations50
US9947624B2Apr 17, 2018

Semiconductor package assembly with through silicon via interconnect

MEDIATEK INC0 citations50
US12218850B2Feb 4, 2025

Transmission rate management method and device

MEDIATEK INC0 citations48
US11805054B1Oct 31, 2023

Method and electronic device for saving power applied to a router

MEDIATEK INC0 citations43
US9859192B2Jan 2, 2018

Semiconductor structure with through-silicon via

MEDIATEK INC0 citations42

MEDIATEK SINGAPORE PTE LTD

3 patents

UNITED MICROELECTRONICS CORP

2 patents

CHANG TIEN-CHANG

2 patents

YANG MING-TZONG

2 patents

HUNG CHENG-CHOU

1 patent

RAYS OPTICS INC

1 patent

SHIH HUNG-LIN

1 patent

VANGUARD INT SEMICONDUCT CORP

1 patent

LIU MING HSIN

1 patent