Inventor
KIM SANG-JUN
KR38 patents
⚠️ This page may combine multiple inventors who share the name “KIM SANG-JUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HYUNDAI MOTOR CO LTD
12 patentsUS11299154B2Apr 12, 2022
Apparatus and method for providing user interface for platooning in vehicle
HYUNDAI MOTOR CO LTD2 citations73
US11119634B2Sep 14, 2021
Apparatus and method for providing user interface for platooning of vehicle
HYUNDAI MOTOR CO LTD2 citations73
US10691137B2Jun 23, 2020
Apparatus and method for controlling platooning in leading vehicle
HYUNDAI MOTOR CO LTD2 citations73
US9789857B2Oct 17, 2017
Apparatus and method of controlling electronic parking brake
HYUNDAI MOTOR CO LTD3 citations73
US9673370B2Jun 6, 2017
Water-and-air-cooled thermoelectric device
HYUNDAI MOTOR CO LTD2 citations73
US11661056B2May 30, 2023
Lane keeping assist apparatus of a vehicle with a trailer, a system having the same, and a method thereof
HYUNDAI MOTOR CO LTD0 citations62
US11740641B2Aug 29, 2023
Platooning controller, a system including the same, and a method thereof
HYUNDAI MOTOR CO LTD0 citations52
US11713055B2Aug 1, 2023
System and method for controlling stop of vehicle
HYUNDAI MOTOR CO LTD0 citations52
US10788842B2Sep 29, 2020
Apparatus and method for controlling platooning in leading vehicle
HYUNDAI MOTOR CO LTD0 citations41
US10705540B2Jul 7, 2020
Apparatus for controlling platooning based on weather information, system including the same, and method thereof
HYUNDAI MOTOR CO LTD0 citations41
US9919579B2Mar 20, 2018
Air conditioning system for driver's seat and method of controlling air conditioning of seat
HYUNDAI MOTOR CO LTD0 citations41
US9387755B2Jul 12, 2016
System and method for controlling charging of hybrid vehicle
HYUNDAI MOTOR CO LTD0 citations41
SAMSUNG ELECTRONICS CO LTD
6 patentsUS7061125B2Jun 13, 2006
Semiconductor package with pattern leads and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD35 citations92
US5925935AJul 20, 1999
Semiconductor chip with shaped bonding pads
SAMSUNG ELECTRONICS CO LTD24 citations92
US7591714B2Sep 22, 2009
Wafer grinding and tape attaching apparatus and method
SAMSUNG ELECTRONICS CO LTD7 citations72
US7576438B2Aug 18, 2009
Printed circuit board and method thereof and a solder ball land and method thereof
SAMSUNG ELECTRONICS CO LTD5 citations72
US9305899B2Apr 5, 2016
Method of fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations63
US8039972B2Oct 18, 2011
Printed circuit board and method thereof and a solder ball land and method thereof
SAMSUNG ELECTRONICS CO LTD1 citations51
SEOUL NAT UNIV R&DB FOUNDATION
4 patentsUS11104976B2Aug 31, 2021
Bi-continuous composite of refractory alloy and copper and method for manufacturing the same
SEOUL NAT UNIV R&DB FOUNDATION0 citations61
US11732335B2Aug 22, 2023
BCC dual phase refractory superalloy with high phase stability and manufacturing method therefore
SEOUL NAT UNIV R&DB FOUNDATION0 citations60
US11512371B2Nov 29, 2022
BCC dual phase refractory superalloy with high phase stability and manufacturing method therefore
SEOUL NAT UNIV R&DB FOUNDATION0 citations60
US11447843B2Sep 20, 2022
Resettable alloys and manufacturing method for the same
SEOUL NAT UNIV R&DB FOUNDATION0 citations46
CJ CHEILJEDANG CORP
3 patentsUS12331339B2Jun 17, 2025
Method of producing sulfur-containing amino acid or derivative thereof
CJ CHEILJEDANG CORP1 citations61
US12203117B2Jan 21, 2025
Method of producing sulfur-containing amino acid or derivative thereof
CJ CHEILJEDANG CORP1 citations61
US11549116B2Jan 10, 2023
Nucleic acid molecules comprising a variant inc coding strand
CJ CHEILJEDANG CORP0 citations61