Inventor
LIN HSING-YEN
TW3 patents
Patents
3 patentsUS9854674B1Dec 26, 2017
Flexible printed circuit and printed circuit board soldered structure
LUXNET CORP4 citations63
US10656355B2May 19, 2020
Heat dissipation structure of horizontal optical-communication sub-assembly
LUXNET CORP0 citations44
US9991674B2Jun 5, 2018
Optical transmitter with a heat dissipation structure
LUXNET CORP0 citations37