P

Inventor

TSAI CHEN-YU

TW37 patents
⚠️ This page may combine multiple inventors who share the name “TSAI CHEN-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

15 patents
US9786580B2Oct 10, 2017

Self-alignment for redistribution layer

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US10510561B2Dec 17, 2019

Semiconductor device package including conformal metal cap contacting each semiconductor die

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations82
US9478480B2Oct 25, 2016

Alignment mark and method of formation

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12237284B2Feb 25, 2025

Semiconductor structure comprising dummy feature interposed between the bonding connectors

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12366004B2Jul 22, 2025

Apparatus and method for wafer pre-wetting

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12227867B2Feb 18, 2025

Plating apparatus for plating semiconductor wafer and plating method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12132016B2Oct 29, 2024

Bonding structures of integrated circuit devices and method forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11990430B2May 21, 2024

Bonding structures of integrated circuit devices and method forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11585008B2Feb 21, 2023

Plating apparatus for plating semiconductor wafer and plating method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11585005B2Feb 21, 2023

Apparatus and method for wafer pre-wetting

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11488842B2Nov 1, 2022

Method of making semiconductor device package including conformal metal cap contacting each semiconductor die

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12278203B2Apr 15, 2025

Semiconductor structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9997497B2Jun 12, 2018

Through silicon via structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9633900B2Apr 25, 2017

Method for through silicon via structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10074595B2Sep 11, 2018

Self-alignment for redistribution layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51

LITE ON ELECTRONICS GUANGZHOU

6 patents

FUSCO IND CORPORATION

4 patents

TSAI CHEN-YU

3 patents

PEGATRON CORP

3 patents

TAIWAN SEMICONDUCTOR MFG

2 patents

YU CHEN-HUA

1 patent

FUSCO IND CORP

1 patent

LITE ON TECHNOLOGY CORP

1 patent

LITE ON ELECTRONICS GUANGZHOU LTD

1 patent