Inventor
PEVZNER MIKHAIL
US11 patents
Patents
11 patentsUS11122692B1Sep 14, 2021
Preparation of solder bump for compatibility with printed electronics and enhanced via reliability
RAYTHEON CO2 citations71
US10999938B1May 4, 2021
Method of wire bonding a first and second circuit card
RAYTHEON CO3 citations67
US11171101B2Nov 9, 2021
Process for removing bond film from cavities in printed circuit boards
RAYTHEON CO0 citations60
US11317502B2Apr 26, 2022
PCB cavity mode suppression
RAYTHEON CO0 citations58
US11497118B2Nov 8, 2022
Method for manufacturing non-planar arrays with a single flex-hybrid circuit card
RAYTHEON CO0 citations57
US11470725B2Oct 11, 2022
Method for fabricating Z-axis vertical launch
RAYTHEON CO0 citations57
US11109489B2Aug 31, 2021
Apparatus for fabricating Z-axis vertical launch within a printed circuit board
RAYTHEON CO0 citations57
US12249752B2Mar 11, 2025
Collapsible dielectric standoff
RAYTHEON CO0 citations52
US11606865B2Mar 14, 2023
Method for forming channels in printed circuit boards by stacking slotted layers
RAYTHEON CO0 citations49
US12266629B2Apr 1, 2025
Ball bond impedance matching
RAYTHEON CO0 citations48
US11653484B2May 16, 2023
Printed circuit board automated layup system
RAYTHEON CO0 citations45