Inventor
BENEDICT JAMES E
US29 patents
Patents
29 patentsUS10826147B2Nov 3, 2020
Radio frequency circuit with a multi-layer transmission line assembly having a conductively filled trench surrounding the transmission line
RAYTHEON CO18 citations85
US10839992B1Nov 17, 2020
Thick film resistors having customizable resistances and methods of manufacture
RAYTHEON CO5 citations79
US10631405B1Apr 21, 2020
Additive manufacturing technology (AMT) inverted pad interface
RAYTHEON CO8 citations78
US11121474B2Sep 14, 2021
Additive manufacturing technology (AMT) low profile radiator
RAYTHEON CO2 citations72
US11122692B1Sep 14, 2021
Preparation of solder bump for compatibility with printed electronics and enhanced via reliability
RAYTHEON CO2 citations71
US10813210B2Oct 20, 2020
Radio frequency circuit comprising at least one substrate with a conductively filled trench therein for electrically isolating a first circuit portion from a second circuit portion
RAYTHEON CO2 citations71
US11089687B2Aug 10, 2021
Additive manufacturing technology (AMT) low profile signal divider
RAYTHEON CO2 citations69
US10999938B1May 4, 2021
Method of wire bonding a first and second circuit card
RAYTHEON CO3 citations67
US12398704B2Aug 26, 2025
Thermally-enhanced and deployable structures
RAYTHEON CO2 citations66
US11581652B2Feb 14, 2023
Spiral antenna and related fabrication techniques
RAYTHEON CO0 citations61
US11569574B2Jan 31, 2023
Millimeter wave phased array
RAYTHEON CO0 citations61
US11289814B2Mar 29, 2022
Spiral antenna and related fabrication techniques
RAYTHEON CO0 citations61
US11145952B2Oct 12, 2021
Advanced communications array
RAYTHEON CO0 citations61
US12021306B2Jun 25, 2024
Low profile phased array
RAYTHEON CO0 citations60
US11375609B2Jun 28, 2022
Method of manufacturing radio frequency interconnections
RAYTHEON CO0 citations60
US11171101B2Nov 9, 2021
Process for removing bond film from cavities in printed circuit boards
RAYTHEON CO0 citations60
US11158955B2Oct 26, 2021
Low profile phased array
RAYTHEON CO0 citations60
US10849219B2Nov 24, 2020
SNAP-RF interconnections
RAYTHEON CO1 citations60
US11145977B2Oct 12, 2021
Interlocking modular beamformer
RAYTHEON CO0 citations59
US11317502B2Apr 26, 2022
PCB cavity mode suppression
RAYTHEON CO0 citations58
US11107610B2Aug 31, 2021
Thick film resistors having customizable resistances and methods of manufacture
RAYTHEON CO0 citations58
US11497118B2Nov 8, 2022
Method for manufacturing non-planar arrays with a single flex-hybrid circuit card
RAYTHEON CO0 citations57
US11470725B2Oct 11, 2022
Method for fabricating Z-axis vertical launch
RAYTHEON CO0 citations57
US11109489B2Aug 31, 2021
Apparatus for fabricating Z-axis vertical launch within a printed circuit board
RAYTHEON CO0 citations57
US11606865B2Mar 14, 2023
Method for forming channels in printed circuit boards by stacking slotted layers
RAYTHEON CO0 citations49
US12266629B2Apr 1, 2025
Ball bond impedance matching
RAYTHEON CO0 citations48
US11432408B2Aug 30, 2022
Additive manufactured reactive beamformer
RAYTHEON CO0 citations47
US12586845B2Mar 24, 2026
Phase change material (PCM)-based conductive thermal actuator switch
RAYTHEON CO0 citations45
US11653484B2May 16, 2023
Printed circuit board automated layup system
RAYTHEON CO0 citations45