Inventor

ICHINOHE HIROAKI

JP6 patents

Patents

6 patents

US11538728B2Dec 27, 2022

Semiconductor package comprising a heat dissipation structure and an outer peripheral frame used as a resin flow barrier

MITSUBISHI ELECTRIC CORP2 citations70

US11309231B2Apr 19, 2022

Semiconductor device

MITSUBISHI ELECTRIC CORP0 citations59

US11393778B2Jul 19, 2022

Semiconductor device and antenna device

MITSUBISHI ELECTRIC CORP0 citations57

US11335619B2May 17, 2022

Semiconductor device

MITSUBISHI ELECTRIC CORP0 citations56

US11121099B2Sep 14, 2021

Semiconductor device

MITSUBISHI ELECTRIC CORP1 citations56

US10211116B2Feb 19, 2019

Semiconductor device

MITSUBISHI ELECTRIC CORP0 citations37