Inventor

QIN SHU

US50 patents

⚠️ This page may combine multiple inventors who share the name “QIN SHU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

QIN SHU

MICRON TECHNOLOGY INC

Devices, systems and methods for electrostatic force enhanced semiconductor bonding

Methods for determining a dose of an impurity implanted in a semiconductor substrate

Phase change memory stack with treated sidewalls

Method of photoresist strip for plasma doping process of semiconductor manufacturing

Phase change memory stack with treated sidewalls

Phase change memory stack with treated sidewalls

Phase change memory stack with treated sidewalls

Phase change memory stack with treated sidewalls

Phase change memory stack with treated sidewalls

Memory cells having regions containing one or both of carbon and boron

Methods of forming doped regions in semiconductor substrates

Systems and methods for plasma processing of microfeature workpieces

Low-k dielectric process for multilevel interconnection using mircocavity engineering during electric circuit manufacture

Devices, systems and methods for electrostatic force enhanced semiconductor bonding

Phase change memory stack with treated sidewalls

Phase change memory stack with treated sidewalls

Devices, systems and methods for electrostatic force enhanced semiconductor bonding

Methods of forming assemblies having heavily doped regions

Devices, systems and methods for electrostatic force enhanced semiconductor bonding

Systems and methods for plasma processing of microfeature workpieces

Memory cells and methods of forming memory cells

Memories and methods of forming thin-film transistors using hydrogen plasma doping

Memories and methods of forming thin-film transistors using hydrogen plasma doping

Sputtering-less ultra-low energy ion implantation

Methods of forming doped regions in semiconductor substrates

Plasma doping of gap fill materials

Plasma doping of gap fill materials

Methods of forming assemblies including semiconductor material with heavily-doped and lightly-doped regions

Integrated assemblies containing germanium

Semiconductor devices

Memory cells and methods of forming memory cells

Methods of forming memory cells having regions containing one or both of carbon and boron

Systems and methods for plasma doping microfeature workpieces

Rapid thermal processing systems and methods for treating microelectronic substrates

QIN SHU

Systems and methods for plasma doping microfeature workpieces

Sputtering-less ultra-low energy ion implantation

Methods of implanting dopant ions

Systems and methods for plasma processing of microfeature workpieces

Methods of processing units comprising crystalline materials, and methods of forming semiconductor-on-insulator constructions

Rapid thermal processing systems and methods for treating microelectronic substrates

Method for fabricating dielectric layer with improved insulating properties

AXCELIS TECH INC

Clamping and de-clamping semiconductor wafers on a J-R electrostatic chuck having a micromachined surface by using force delay in applying a single-phase square wave AC clamping voltage

Method of making a MEMS electrostatic chuck

MEMS based multi-polar electrostatic chuck

Clamping and de-clamping semiconductor wafers on an electrostatic chuck using wafer inertial confinement by applying a single-phase square wave AC clamping voltage

MEMS based contact conductivity electrostatic chuck

UNIV NORTHEASTERN

Apparatus and method for hydrogenating polysilicon thin film transistors by plasma immersion ion implantation

Plasma ion implantation hydrogenation process utilizing voltage pulse applied to substrate

APTINA IMAGING CORP

Method of forming elevated photosensor and resulting structure

LIU JENNIFER LEQUN

Methods of forming doped regions in semiconductor substrates