Inventor

KITAI YUKI

JP26 patents

⚠️ This page may combine multiple inventors who share the name “KITAI YUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KITAI YUKI

PANASONIC IP MAN CO LTD

Modified polyphenylene ether, method for preparing same, polyphenylene ether resin composition, resin varnish, prepreg, metal-clad laminate and printed circuit board

Copper-clad laminate plate, resin-attached copper foil, and circuit board using same

Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board

Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board

Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board

Surface-treated copper foil, and copper-clad laminate plate, resin-attached copper foil and circuit board each using same

Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring board

Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate

Metal-clad laminate, printed wiring board and metal foil with resin

Metal-clad laminate, method for producing same, metal foil with resin, and printed wiring board

Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board

Method of curing thermosetting resin composition, thermosetting resin composition, and PREPREG, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used

Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used

Prepreg, and metal-clad laminated board and wiring substrate obtained using same

Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil

Copper-clad laminate, wiring board, and copper foil with resin

Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board

Prepreg, metal-clad laminate, and wiring board

Prepreg, metal-clad laminate, and wiring board

Prepreg, metal-clad laminate, and wiring board

Metal-clad laminate, metal member with resin, and wiring board

Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminated board, and wiring board

Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board

Metal-clad laminate and metal foil with resin

FUKUHARA YASUO

Prepreg, printed wiring board, multilayer circuit board, and process for manufacturing printed wiring board

SAGARA TAKASHI

Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board