Inventor
LIU CHIAHUNG
TW13 patents
Patents
13 patentsUS10832985B2Nov 10, 2020
Sensor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations85
US11742254B2Aug 29, 2023
Sensor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10840227B2Nov 17, 2020
Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US12489064B2Dec 2, 2025
Method for forming mark, packaging method of semiconductor device, and semiconductor device having the mark
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12205860B2Jan 21, 2025
Sensor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11631658B2Apr 18, 2023
Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11527525B2Dec 13, 2022
Semiconductor device with multiple polarity groups
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11049850B2Jun 29, 2021
Methods of bonding the strip-shaped under bump metallization structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10861841B2Dec 8, 2020
Semiconductor device with multiple polarity groups
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12227410B2Feb 18, 2025
Semiconductor device and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11897759B2Feb 13, 2024
Semiconductor device and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10658348B2May 19, 2020
Semiconductor devices having a plurality of first and second conductive strips
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11842993B2Dec 12, 2023
Semiconductor device with multiple polarity groups
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51