Inventor

SUN YANGYANG

US33 patents

⚠️ This page may combine multiple inventors who share the name “SUN YANGYANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUN YANGYANG

APPLIED MATERIALS INC

Full-field metrology tool for waveguide combiners and meta-surfaces

Method of measuring efficiency for optical devices

In-line metrology systems, apparatus, and methods for optical devices

In-line metrology systems, apparatus, and methods for optical devices

Interference in-sensitive Littrow system for optical device structure measurement

See-through metrology systems, apparatus, and methods for optical devices

Interference in-sensitive Littrow system for optical device structure measurement

See-through metrology systems, apparatus, and methods for optical devices

Ultra-wide angle lens systems with external pupil

Methods for high-resolution, stable measurement of pitch and orientation in optical gratings

Optical resolution measurement method for optical devices

Illumination system for AR metrology tool

Methods of geometry parameters measurement for optical gratings

QUALCOMM INC

Flip-chip device

Repurposed seed layer for high frequency noise control and electrostatic discharge connection

Thermal compression flip chip bump for high performance and fine pitch

Package comprising spacers between integrated devices

Flip-chip flexible under bump metallization size

High density and reliable vertical natural capacitors

Three-dimensional (3D) integrated circuit (IC) (3DIC) package with a bottom die layer employing an extended interposer substrate, and related fabrication methods

Package comprising an interconnection die located between substrates

Flip-chip bumping metal layer and bump structure

Package comprising wire bonds coupled to integrated devices

Integrated circuit (IC) package employing a re-distribution layer (RDL) substrate(s) with photosensitive dielectric layer(s) for increased package rigidity, and related fabrication methods

Integrated device comprising interconnect structures having an inner interconnect, a dielectric layer and a conductive layer

Package comprising a substrate and a high-density interconnect integrated device

GANDHI JASPREET S

Methods for forming a semiconductor structure

Integrated circuit constructions having through substrate vias and methods of forming integrated circuit constructions having through substrate vias

SUN YANGYANG

Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages

UNIV CENTRAL FLORIDA RES FOUND INC

Fiber imaging apparatus, methods, and applications

MICRON TECHNOLOGY INC

Semiconductor structures comprising a dielectric material having a curvilinear profile

CHINA CONSTRUCTION STEEL STRUCTURE CORP LTD

Supporting device and method for calculating jacking force thereof

QINGDAO SHENGHAN CHROMATOGRAPH TECH CO LTD

Ion chromatography (IC) suppressor