Inventor
KOH KYONG HWAN
KR6 patents
Patents
6 patentsUS11107769B2Aug 31, 2021
Semiconductor package and a method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations70
US11996365B2May 28, 2024
Semiconductor package and a method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11610845B2Mar 21, 2023
Semiconductor package and a method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US12132007B2Oct 29, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11581266B2Feb 14, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US12057357B2Aug 6, 2024
Semiconductor package including plurality of recesses and molding member with plurality of protrusions that fill the recesses
SAMSUNG ELECTRONICS CO LTD0 citations48