Inventor
OH JUHYEON
KR7 patents
Patents
7 patentsUS10825774B2Nov 3, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD7 citations82
US11217517B2Jan 4, 2022
Semiconductor package with a trench portion
SAMSUNG ELECTRONICS CO LTD2 citations70
US12406934B2Sep 2, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11437326B2Sep 6, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US12132007B2Oct 29, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11581266B2Feb 14, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US12057357B2Aug 6, 2024
Semiconductor package including plurality of recesses and molding member with plurality of protrusions that fill the recesses
SAMSUNG ELECTRONICS CO LTD0 citations48