Inventor
Wu ming-hao
TW23 patents
⚠️ This page may combine multiple inventors who share the name “Wu ming-hao”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIMICRON TECHNOLOGY CORP
22 patentsUS9609746B1Mar 28, 2017
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP9 citations83
US9491865B1Nov 8, 2016
Circuit board and method for manufacturing the same
UNIMICRON TECHNOLOGY CORP8 citations83
US10039184B2Jul 31, 2018
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP9 citations82
US10939538B1Mar 2, 2021
Circuit board structure
UNIMICRON TECHNOLOGY CORP5 citations72
US10616992B2Apr 7, 2020
Circuit board and method for manufacturing the same
UNIMICRON TECHNOLOGY CORP2 citations72
US9860984B2Jan 2, 2018
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP3 citations72
US10356901B2Jul 16, 2019
Manufacturing method of circuit board structure
UNIMICRON TECHNOLOGY CORP4 citations71
US9258908B2Feb 9, 2016
Substrate structure having component-disposing area and manufacturing process thereof
UNIMICRON TECHNOLOGY CORP3 citations71
US9832873B2Nov 28, 2017
Circuit board structure
UNIMICRON TECHNOLOGY CORP1 citations62
US12016133B2Jun 18, 2024
Circuit board with a conductive bump mounted on an adhesive layer
UNIMICRON TECHNOLOGY CORP0 citations59
US10314179B2Jun 4, 2019
Manufacturing method of circuit structure
UNIMICRON TECHNOLOGY CORP1 citations59
US11910535B2Feb 20, 2024
Printed circuit board stack structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations51
US9883598B2Jan 30, 2018
Circuit board and method for manufacturing the same
UNIMICRON TECHNOLOGY CORP0 citations51
US12563668B2Feb 24, 2026
Circuit board, manufacturing method thereof, and electronic device
UNIMICRON TECHNOLOGY CORP0 citations50
US12256488B2Mar 18, 2025
Circuit board structure
UNIMICRON TECHNOLOGY CORP0 citations50
US12144113B2Nov 12, 2024
Circuit board structure
UNIMICRON TECHNOLOGY CORP0 citations50
US11545412B2Jan 3, 2023
Package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US9646852B2May 9, 2017
Manufacturing process for substrate structure having component-disposing area
UNIMICRON TECHNOLOGY CORP1 citations50
US10736215B1Aug 4, 2020
Multilayer circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations49
US10051748B2Aug 14, 2018
Circuit structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP1 citations48
US12426168B2Sep 23, 2025
Circuit board structure and method for forming the same
UNIMICRON TECHNOLOGY CORP0 citations47
US12156325B2Nov 26, 2024
Package carrier with improved heat dissipation efficiency and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations47