Inventor
Huang jun-rui
TW9 patents
Patents
9 patentsUS12052815B2Jul 30, 2024
Manufacturing method of circuit board
UNIMICRON TECHNOLOGY CORP0 citations59
US11785707B2Oct 10, 2023
Circuit board and manufacturing method thereof and electronic device
UNIMICRON TECHNOLOGY CORP0 citations59
US12563668B2Feb 24, 2026
Circuit board, manufacturing method thereof, and electronic device
UNIMICRON TECHNOLOGY CORP0 citations50
US12256488B2Mar 18, 2025
Circuit board structure
UNIMICRON TECHNOLOGY CORP0 citations50
US12177964B2Dec 24, 2024
Circuit board and manufacturing method thereof and electronic device
UNIMICRON TECHNOLOGY CORP0 citations50
US12144113B2Nov 12, 2024
Circuit board structure
UNIMICRON TECHNOLOGY CORP0 citations50
US11895772B2Feb 6, 2024
Interlayer connective structure of wiring board and method of manufacturing the same
UNIMICRON TECHNOLOGY CORP0 citations48
US11737209B2Aug 22, 2023
Circuit board and manufacturing method thereof and electronic device
UNIMICRON TECHNOLOGY CORP0 citations48
US12057381B2Aug 6, 2024
Circuit board having laminated build-up layers
UNIMICRON TECHNOLOGY CORP0 citations47