Inventor

HWANG JI-HWAN

KR22 patents

⚠️ This page may combine multiple inventors who share the name “HWANG JI-HWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HWANG JI-HWAN

SAMSUNG ELECTRONICS CO LTD

Semiconductor package

Semiconductor package having a high reliability

Semiconductor package

Semiconductor package having recessed adhesive layer between stacked chips

Die stack structure, semiconductor package having the same and method of manufacturing the same

Semiconductor package having a high reliability

Semiconductor package

Semiconductor package having a high reliability

Semiconductor package having a high reliability

Semiconductor package having a high reliability

Semiconductor package having a high reliability

Semiconductor package including test pad

Method of manufacturing a semiconductor package

Semiconductor package

Semiconductor package

Semiconductor package including test pad

Light emitting diode display device

Apparatus for stacking semiconductor chips in a semiconductor package

LEE CHUNG-SUN

Stack package and semiconductor package including the same

TOSHIBA MEMORY CORP

Magnetic memory and method of manufacturing magnetic memory

JEE YOUNG-KUN

Semiconductor package having an anti-contact layer

HWANG JI-HWAN

Wiring substrate, tape package having the same, and display device having the same