Inventor
HSIA CHIN-CHIU
TW17 patents
⚠️ This page may combine multiple inventors who share the name “HSIA CHIN-CHIU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
13 patentsUS6737345B1May 18, 2004
Scheme to define laser fuse in dual damascene CU process
TAIWAN SEMICONDUCTOR MFG79 citations97
US7592710B2Sep 22, 2009
Bond pad structure for wire bonding
TAIWAN SEMICONDUCTOR MFG19 citations92
US7291557B2Nov 6, 2007
Method for forming an interconnection structure for ic metallization
TAIWAN SEMICONDUCTOR MFG20 citations92
US7253531B1Aug 7, 2007
Semiconductor bonding pad structure
TAIWAN SEMICONDUCTOR MFG23 citations92
US7042097B2May 9, 2006
Structure for reducing stress-induced voiding in an interconnect of integrated circuits
TAIWAN SEMICONDUCTOR MFG14 citations84
US6831365B1Dec 14, 2004
Method and pattern for reducing interconnect failures
TAIWAN SEMICONDUCTOR MFG18 citations84
US7312486B1Dec 25, 2007
Stripe board dummy metal for reducing coupling capacitance
TAIWAN SEMICONDUCTOR MFG2 citations62
US6835578B1Dec 28, 2004
Test structure for differentiating the line and via contribution in stress migration
TAIWAN SEMICONDUCTOR MFG4 citations62
US7777338B2Aug 17, 2010
Seal ring structure for integrated circuit chips
TAIWAN SEMICONDUCTOR MFG6 citations61
US7849432B2Dec 7, 2010
Shallow trench isolation dummy pattern and layout method using the same
TAIWAN SEMICONDUCTOR MFG2 citations60
US7388263B2Jun 17, 2008
Shallow trench isolation dummy pattern and layout method using the same
TAIWAN SEMICONDUCTOR MFG3 citations60
US7470994B2Dec 30, 2008
Bonding pad structure and method for making the same
TAIWAN SEMICONDUCTOR MFG0 citations52
US7151052B2Dec 19, 2006
Multiple etch-stop layer deposition scheme and materials
TAIWAN SEMICONDUCTOR MFG0 citations41
IND TECH RES INST
3 patentsUS6361909B1Mar 26, 2002
Illumination aperture filter design using superposition
IND TECH RES INST82 citations98
US6566752B2May 20, 2003
Bonding pad and method for manufacturing it
IND TECH RES INST16 citations92
US6426555B1Jul 30, 2002
Bonding pad and method for manufacturing it
IND TECH RES INST15 citations83