Inventor
JUNG YANGGYOO
KR9 patents
Patents
9 patentsUS11721679B2Aug 8, 2023
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations71
US11145637B2Oct 12, 2021
Semiconductor package including a substrate having two silicon layers formed on each other
SAMSUNG ELECTRONICS CO LTD4 citations71
US12278222B2Apr 15, 2025
Method of fabricating semiconductor package including sub-interposer substrates
SAMSUNG ELECTRONICS CO LTD0 citations61
US12057408B2Aug 6, 2024
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations59
US12021032B2Jun 25, 2024
Semiconductor package having an interposer and method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations56
US11694961B2Jul 4, 2023
Semiconductor package having an interposer and method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations56
US11935867B2Mar 19, 2024
Semiconductor package with memory stack structure connected to logic dies via an interposer
SAMSUNG ELECTRONICS CO LTD0 citations48
US12237241B2Feb 25, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations46
US12272628B2Apr 8, 2025
Semiconductor package having interposer substrate
SAMSUNG ELECTRONICS CO LTD0 citations44