Inventor
TSUKANO JUN
JP14 patents
⚠️ This page may combine multiple inventors who share the name “TSUKANO JUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC ELECTRONICS CORP
5 patentsUS6762488B2Jul 13, 2004
Light thin stacked package semiconductor device and process for fabrication thereof
NEC ELECTRONICS CORP222 citations98
US7745736B2Jun 29, 2010
Interconnecting substrate and semiconductor device
NEC ELECTRONICS CORP15 citations84
US7649749B2Jan 19, 2010
Wiring substrate, semiconductor device, and method of manufacturing the same
NEC ELECTRONICS CORP10 citations84
US7674989B2Mar 9, 2010
Wiring board and method for manufacturing the same
NEC ELECTRONICS CORP2 citations62
US7701726B2Apr 20, 2010
Method of manufacturing a wiring substrate and semiconductor device
NEC ELECTRONICS CORP1 citations52
CANON KK
4 patentsUS11765448B2Sep 19, 2023
Electronic component including electronic substrate and circuit member, apparatus, and camera
CANON KK0 citations61
US11528392B2Dec 13, 2022
Electronic component including electronic substrate and circuit member, apparatus, and camera
CANON KK0 citations61
US12292657B2May 6, 2025
Electronic component, manufacturing method thereof, and electronic apparatus
CANON KK0 citations51
US11448914B2Sep 20, 2022
Method of manufacturing electronic module, method of manufacturing optical module, electronic module, optical module, and device
CANON KK0 citations51