P

Inventor

WILLIAMSON JAIMAL MALLORY

US16 patents
⚠️ This page may combine multiple inventors who share the name “WILLIAMSON JAIMAL MALLORY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TEXAS INSTRUMENTS INC

15 patents
US11289412B2Mar 29, 2022

Package substrate with partially recessed capacitor

TEXAS INSTRUMENTS INC6 citations84
US9934989B1Apr 3, 2018

Process for forming leadframe having organic, polymerizable photo-imageable adhesion layer

TEXAS INSTRUMENTS INC6 citations81
US12278205B2Apr 15, 2025

Semiconductor device package with improved die pad and solder mask design

TEXAS INSTRUMENTS INC2 citations72
US11804382B2Oct 31, 2023

Method of forming package substrate with partially recessed capacitor

TEXAS INSTRUMENTS INC2 citations71
US9281269B2Mar 8, 2016

Integrated circuit package and method of manufacture

TEXAS INSTRUMENTS INC3 citations70
US11081406B2Aug 3, 2021

Via integrity and board level reliability testing

TEXAS INSTRUMENTS INC2 citations63
US12243835B2Mar 4, 2025

Package substrate with CTE matching barrier ring around microvias

TEXAS INSTRUMENTS INC0 citations60
US11270955B2Mar 8, 2022

Package substrate with CTE matching barrier ring around microvias

TEXAS INSTRUMENTS INC0 citations60
US12489075B2Dec 2, 2025

Enhanced mold compound thermal conductivity

TEXAS INSTRUMENTS INC0 citations59
US12593710B2Mar 31, 2026

Package substrate having porous dielectric layer

TEXAS INSTRUMENTS INC0 citations53
US11973017B2Apr 30, 2024

Package substrate having porous dielectric layer

TEXAS INSTRUMENTS INC0 citations53
US12199008B2Jan 14, 2025

Package heat dissipation including a die attach film

TEXAS INSTRUMENTS INC0 citations50
US10748863B2Aug 18, 2020

Semiconductor devices having metal posts for stress relief at flatness discontinuities

TEXAS INSTRUMENTS INC0 citations49
US10672692B2Jun 2, 2020

Leadframe having organic, polymerizable photo-imageable adhesion layer

TEXAS INSTRUMENTS INC0 citations49
US12266597B2Apr 1, 2025

Multilevel package substrate with stair shaped substrate traces

TEXAS INSTRUMENTS INC0 citations44

ODEGARD CHARLES ANTHONY

1 patent