Inventor
IGARASHI KAZUMASA
JP27 patents
⚠️ This page may combine multiple inventors who share the name “IGARASHI KAZUMASA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NITTO DENKO CORP
12 patentsUS5990546ANov 23, 1999
Chip scale package type of semiconductor device
NITTO DENKO CORP187 citations98
US5814894ASep 29, 1998
Semiconductor device, production method thereof, and tape carrier for semiconductor device used for producing the semiconductor device
NITTO DENKO CORP205 citations97
US6695985B2Feb 24, 2004
Electromagnetic wave suppressor sheet
NITTO DENKO CORP56 citations96
US6800804B2Oct 5, 2004
Epoxy resin composition used for encapsulating semiconductor and semiconductor device using the composition
NITTO DENKO CORP36 citations92
US6674016B2Jan 6, 2004
Electronic component
NITTO DENKO CORP15 citations84
US6383660B2May 7, 2002
Epoxy resin composition for encapsulating semiconductor and semiconductor device using the same
NITTO DENKO CORP7 citations74
US5053314AOct 1, 1991
Positively photosensitive polyimide composition
NITTO DENKO CORP11 citations74
US6117616ASep 12, 2000
Circuit-forming substrate and circuit substrate
NITTO DENKO CORP7 citations73
US5294835AMar 15, 1994
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
NITTO DENKO CORP18 citations71
US7352069B2Apr 1, 2008
Electronic component unit
NITTO DENKO CORP5 citations62
US7034405B2Apr 25, 2006
Resin component for encapsulating semiconductor and semiconductor device using it
NITTO DENKO CORP3 citations62
US6333139B1Dec 25, 2001
Circuit-forming substrate and circuit substrate
NITTO DENKO CORP4 citations62
TOKYO ELECTRON LTD
7 patentsUS12080517B2Sep 3, 2024
Ignition method and plasma processing apparatus
TOKYO ELECTRON LTD2 citations73
US8895414B1Nov 25, 2014
Method and apparatus for forming amorphous silicon film
TOKYO ELECTRON LTD4 citations73
US12588440B2Mar 24, 2026
Substrate processing method and substrate processing apparatus for etching using oxidization
TOKYO ELECTRON LTD0 citations62
US11781219B2Oct 10, 2023
Processing apparatus and processing method
TOKYO ELECTRON LTD0 citations62
US9777366B2Oct 3, 2017
Thin film forming method
TOKYO ELECTRON LTD1 citations52
US9145604B2Sep 29, 2015
Thin film forming method and film forming apparatus
TOKYO ELECTRON LTD1 citations52
US11923177B2Mar 5, 2024
Plasma processing apparatus and plasma processing method
TOKYO ELECTRON LTD0 citations47