Inventor
WELSH JOHN A
US19 patents
Patents
19 patentsUS6204453B1Mar 20, 2001
Two signal one power plane circuit board
IBM173 citations98
US6453549B1Sep 24, 2002
Method of filling plated through holes
IBM73 citations96
US6750405B1Jun 15, 2004
Two signal one power plane circuit board
IBM19 citations92
US6201194B1Mar 13, 2001
Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric
IBM43 citations92
US6099959AAug 8, 2000
Method of controlling the spread of an adhesive on a circuitized organic substrate
IBM23 citations92
US6009620AJan 4, 2000
Method of making a printed circuit board having filled holes
IBM41 citations89
US7353590B2Apr 8, 2008
Method of forming printed circuit card
IBM10 citations83
US4599134AJul 8, 1986
Plasma etching with tracer
IBM23 citations81
US6986198B2Jan 17, 2006
Method of forming printed circuit card
IBM6 citations73
US6524654B1Feb 25, 2003
Method of controlling the spread of an adhesive on a circuitized organic substrate
IBM10 citations73
US6432182B1Aug 13, 2002
Treatment solution for reducing adhesive resin bleed
IBM5 citations73
US4431685AFeb 14, 1984
Decreasing plated metal defects
IBM7 citations73
US5114518AMay 19, 1992
Method of making multilayer circuit boards having conformal Insulating layers
IBM8 citations72
US4618477AOct 21, 1986
Uniform plasma for drill smear removal reactor
IBM16 citations72
US4810326AMar 7, 1989
Interlaminate adhesion between polymeric materials and electrolytic copper surfaces
IBM18 citations71
US4971715ANov 20, 1990
Phenolic-free stripping composition and use thereof
IBM18 citations67
US6274291B1Aug 14, 2001
Method of reducing defects in I/C card and resulting card
IBM4 citations57
US4918574AApr 17, 1990
Multilayer circuit board with reduced susceptability to shorts caused by trapped impurities
IBM0 citations51
US6488198B1Dec 3, 2002
Wire bonding method and apparatus
IBM1 citations47