Inventor
OCHI KATSUNORI
JP22 patents
Patents
22 patentsUS4974120ANov 27, 1990
IC card
MITSUBISHI ELECTRIC CORP157 citations99
US5735040AApr 7, 1998
Method of making IC card
MITSUBISHI ELECTRIC CORP122 citations98
US5416358AMay 16, 1995
IC card including frame with lateral hole for injecting encapsulating resin
MITSUBISHI ELECTRIC CORP116 citations97
US5949135ASep 7, 1999
Module mounted with semiconductor device
MITSUBISHI ELECTRIC CORP76 citations96
US5498388AMar 12, 1996
Production method for an IC card
MITSUBISHI ELECTRIC CORP54 citations96
US5272374ADec 21, 1993
Production method for an IC card and its IC card
MITSUBISHI ELECTRIC CORP106 citations96
US5250341AOct 5, 1993
IC card
MITSUBISHI ELECTRIC CORP69 citations96
US5173840ADec 22, 1992
Molded ic card
MITSUBISHI ELECTRIC CORP118 citations96
US5677568AOct 14, 1997
Thin IC card
MITSUBISHI ELECTRIC CORP62 citations95
US5244840ASep 14, 1993
Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
MITSUBISHI ELECTRIC CORP100 citations95
US5912806AJun 15, 1999
IC card of simple structure
MITSUBISHI ELECTRIC CORP37 citations92
US5889327AMar 30, 1999
Semiconductor device with a package having a plurality of bump electrodes and module with a plurality of semiconductor devices
MITSUBISHI ELECTRIC CORP25 citations92
US5886874AMar 23, 1999
IC card
MITSUBISHI ELECTRIC CORP44 citations92
US5877548AMar 2, 1999
Terminal configuration in semiconductor IC device
MITSUBISHI ELECTRIC CORP31 citations92
US5719746AFeb 17, 1998
IC card
MITSUBISHI ELECTRIC CORP30 citations92
US5671123ASep 23, 1997
IC card with a discharge pattern and a ground pattern separated from each other
MITSUBISHI ELECTRIC CORP51 citations92
US5520863AMay 28, 1996
Method of making IC card
MITSUBISHI ELECTRIC CORP29 citations92
US5079673AJan 7, 1992
Ic card module
MITSUBISHI ELECTRIC CORP37 citations92
US5184209AFeb 2, 1993
Ic card and manufacturing method therefor
MITSUBISHI ELECTRIC CORP34 citations91
US6031278AFeb 29, 2000
IC card and manufacturing method thereof
MITSUBISHI ELECTRIC CORP14 citations74
US5346576ASep 13, 1994
Method of manufacturing IC card
MITSUBISHI ELECTRIC CORP15 citations74
US5410182AApr 25, 1995
High density semiconductor device having inclined chip mounting
MITSUBISHI ELECTRIC CORP18 citations73