Inventor
ENQUIST PAUL M
US75 patents
⚠️ This page may combine multiple inventors who share the name “ENQUIST PAUL M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ZIPTRONIX INC
31 patentsUS9431368B2Aug 30, 2016
Three dimensional device integration method and integrated device
ZIPTRONIX INC194 citations99
US9391143B2Jul 12, 2016
Method for low temperature bonding and bonded structure
ZIPTRONIX INC117 citations99
US9331149B2May 3, 2016
Method for low temperature bonding and bonded structure
ZIPTRONIX INC185 citations99
US9171756B2Oct 27, 2015
3D IC method and device
ZIPTRONIX INC232 citations99
US7485968B2Feb 3, 2009
3D IC method and device
ZIPTRONIX INC433 citations99
US7387944B2Jun 17, 2008
Method for low temperature bonding and bonded structure
ZIPTRONIX INC68 citations99
US7041178B2May 9, 2006
Method for low temperature bonding and bonded structure
ZIPTRONIX INC129 citations99
US6984571B1Jan 10, 2006
Three dimensional device integration method and integrated device
ZIPTRONIX INC162 citations99
US6902987B1Jun 7, 2005
Method for low temperature bonding and bonded structure
ZIPTRONIX INC227 citations99
US6867073B1Mar 15, 2005
Single mask via method and device
ZIPTRONIX INC216 citations99
US6864585B2Mar 8, 2005
Three dimensional device integration method and integrated device
ZIPTRONIX INC114 citations99
US6500694B1Dec 31, 2002
Three dimensional device integration method and integrated device
ZIPTRONIX INC156 citations99
US9716033B2Jul 25, 2017
3D IC method and device
ZIPTRONIX INC29 citations98
US9564414B2Feb 7, 2017
Three dimensional device integration method and integrated device
ZIPTRONIX INC37 citations98
US9385024B2Jul 5, 2016
Room temperature metal direct bonding
ZIPTRONIX INC211 citations98
US9184125B2Nov 10, 2015
Heterogeneous annealing method and device
ZIPTRONIX INC205 citations98
US6962835B2Nov 8, 2005
Method for room temperature metal direct bonding
ZIPTRONIX INC235 citations98
US9082627B2Jul 14, 2015
Method for low temperature bonding and bonded structure
ZIPTRONIX INC20 citations96
US7807549B2Oct 5, 2010
Method for low temperature bonding and bonded structure
ZIPTRONIX INC41 citations96
US7602070B2Oct 13, 2009
Room temperature metal direct bonding
ZIPTRONIX INC33 citations96
US7553744B2Jun 30, 2009
Method for low temperature bonding and bonded structure
ZIPTRONIX INC35 citations96
US7335572B2Feb 26, 2008
Method for low temperature bonding and bonded structure
ZIPTRONIX INC39 citations96
US7037755B2May 2, 2006
Three dimensional device integration method and integrated device
ZIPTRONIX INC58 citations96
US6905557B2Jun 14, 2005
Three dimensional integrated device
ZIPTRONIX INC33 citations96
US6627531B2Sep 30, 2003
Three dimensional device integration method and integrated device
ZIPTRONIX INC73 citations96
US7126212B2Oct 24, 2006
Three dimensional device integration method and integrated device
ZIPTRONIX INC247 citations95
US8709938B2Apr 29, 2014
3D IC method and device
ZIPTRONIX INC13 citations93
US8053329B2Nov 8, 2011
Method for low temperature bonding and bonded structure
ZIPTRONIX INC7 citations93
US7871898B2Jan 18, 2011
Method for low temperature bonding and bonded structure
ZIPTRONIX INC9 citations93
US7341938B2Mar 11, 2008
Single mask via method and device
ZIPTRONIX INC14 citations93
US7842540B2Nov 30, 2010
Room temperature metal direct bonding
ZIPTRONIX INC11 citations92
INVENSAS BONDING TECH INC
8 patentsUS11276676B2Mar 15, 2022
Stacked devices and methods of fabrication
INVENSAS BONDING TECH INC156 citations99
US10522499B2Dec 31, 2019
Bonded structures
INVENSAS BONDING TECH INC137 citations99
US10446532B2Oct 15, 2019
Systems and methods for efficient transfer of semiconductor elements
INVENSAS BONDING TECH INC161 citations99
US9953941B2Apr 24, 2018
Conductive barrier direct hybrid bonding
INVENSAS BONDING TECH INC251 citations99
US9852988B2Dec 26, 2017
Increased contact alignment tolerance for direct bonding
INVENSAS BONDING TECH INC218 citations99
US10269708B2Apr 23, 2019
Increased contact alignment tolerance for direct bonding
INVENSAS BONDING TECH INC49 citations98
US10147641B2Dec 4, 2018
3D IC method and device
INVENSAS BONDING TECH INC47 citations98
US10262963B2Apr 16, 2019
Conductive barrier direct hybrid bonding
INVENSAS BONDING TECH INC19 citations94
TONG QIN-YI
2 patentsZIPTRONIX
2 patentsRES TRIANGLE INST
2 patentsENQUIST PAUL M
2 patentsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC
2 patentsSANDIA CORP
1 patentShowing the top 50 of 75 patents by PatentIndex Score.