Inventor
SHIBUYA AKINOBU
JP19 patents
⚠️ This page may combine multiple inventors who share the name “SHIBUYA AKINOBU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
14 patentsUS6818469B2Nov 16, 2004
Thin film capacitor, method for manufacturing the same and printed circuit board incorporating the same
NEC CORP71 citations98
US6524905B2Feb 25, 2003
Semiconductor device, and thin film capacitor
NEC CORP76 citations98
US6515324B2Feb 4, 2003
Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, and method for manufacturing same
NEC CORP59 citations96
US6278153B1Aug 21, 2001
Thin film capacitor formed in via
NEC CORP62 citations96
US6703705B2Mar 9, 2004
Semiconductor device and method for packaging same
NEC CORP31 citations92
US6466124B1Oct 15, 2002
Thin film resistor and method for forming the same
NEC CORP24 citations92
US5576518ANov 19, 1996
Via-structure of a multilayer interconnection ceramic substrate
NEC CORP37 citations92
US6618694B1Sep 9, 2003
Method, apparatus and computer program product for forming data to be analyzed by finite element method and calculation method based on finite element method
NEC CORP28 citations89
US6331811B2Dec 18, 2001
Thin-film resistor, wiring substrate, and method for manufacturing the same
NEC CORP15 citations84
US10544363B2Jan 28, 2020
Ceramic emitter
NEC CORP3 citations73
US5485352AJan 16, 1996
Element joining pad for semiconductor device mounting board
NEC CORP9 citations73
US6949815B2Sep 27, 2005
Semiconductor device with decoupling capacitors mounted on conductors
NEC CORP4 citations63
US11326071B2May 10, 2022
Coating material and solidified body of coating material
NEC CORP0 citations62
US10908078B2Feb 2, 2021
Monitoring method, monitoring system, and structure, construction, or movable body
NEC CORP1 citations62
SHIBUYA AKINOBU
5 patentsUS8237292B2Aug 7, 2012
Semiconductor device and method for manufacturing the same
SHIBUYA AKINOBU8 citations82
US8802496B2Aug 12, 2014
Substrate for semiconductor package and method of manufacturing thereof
SHIBUYA AKINOBU5 citations70
US8531023B2Sep 10, 2013
Substrate for semiconductor package and method of manufacturing thereof
SHIBUYA AKINOBU2 citations60
US8621730B2Jan 7, 2014
Capacitor producing method for producing thin-film capacitors eliminating defects
SHIBUYA AKINOBU0 citations51
US8669138B2Mar 11, 2014
Semiconductor device and method for manufacturing the same
SHIBUYA AKINOBU1 citations50