Inventor
KIMURA MITSURU
JP11 patents
⚠️ This page may combine multiple inventors who share the name “KIMURA MITSURU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
10 patentsUS5714112AFeb 3, 1998
Process for producing a silica sintered product for a multi-layer wiring substrate
NEC CORP43 citations95
US5545281AAug 13, 1996
Method of bonding circuit boards
NEC CORP50 citations95
US5318651AJun 7, 1994
Method of bonding circuit boards
NEC CORP46 citations95
US5576518ANov 19, 1996
Via-structure of a multilayer interconnection ceramic substrate
NEC CORP37 citations92
US4874721AOct 17, 1989
Method of manufacturing a multichip package with increased adhesive strength
NEC CORP66 citations92
US5506058AApr 9, 1996
Mutlilayer glass ceramic substrate and method of fabricating the same
NEC CORP10 citations73
US5485352AJan 16, 1996
Element joining pad for semiconductor device mounting board
NEC CORP9 citations73
US4594473AJun 10, 1986
Substrate having at least one fine-wired conductive layer
NEC CORP15 citations73
US5757062AMay 26, 1998
Ceramic substrate for semiconductor device
NEC CORP2 citations62
US5728470AMar 17, 1998
Multi-layer wiring substrate, and process for producing the same
NEC CORP4 citations62