Inventor
IGUSA NOBUO
JP4 patents
Patents
4 patentsUS5984165ANov 16, 1999
Method of bonding a chip part to a substrate using solder bumps
FUJITSU LTD81 citations91
US6140286AOct 31, 2000
Defluxing agent cleaning method and cleaning apparatus
FUJITSU LTD9 citations72
US6050479AApr 18, 2000
Defluxing agent cleaning method and cleaning apparatus
FUJITSU LTD5 citations72
US5695571ADec 9, 1997
Cleaning method using a defluxing agent
FUJITSU LTD12 citations72