Inventor

DIBENE II JOSEPH TED

US10 patents

⚠️ This page may combine multiple inventors who share the name “DIBENE II JOSEPH TED”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INCEP TECHNOLOGIES INC

6 patents

US6304450B1Oct 16, 2001

Inter-circuit encapsulated packaging

INCEP TECHNOLOGIES INC244 citations97

US6452113B2Sep 17, 2002

Apparatus for providing power to a microprocessor with integrated thermal and EMI management

INCEP TECHNOLOGIES INC88 citations95

US6847529B2Jan 25, 2005

Ultra-low impedance power interconnection system for electronic packages

INCEP TECHNOLOGIES INC42 citations92

US6741480B2May 25, 2004

Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems

INCEP TECHNOLOGIES INC23 citations92

US6623279B2Sep 23, 2003

Separable power delivery connector

INCEP TECHNOLOGIES INC42 citations92

US6698511B2Mar 2, 2004

Vortex heatsink for high performance thermal applications

INCEP TECHNOLOGIES INC41 citations89

MOLEX INC

1 patent

US7881072B2Feb 1, 2011

System and method for processor power delivery and thermal management

MOLEX INC73 citations97

INCEPTECHNOLOGIES INC

1 patent

US6356448B1Mar 12, 2002

Inter-circuit encapsulated packaging for power delivery

INCEPTECHNOLOGIES INC147 citations95

INCEP TECHNOLOGIES

1 patent

US6947293B2Sep 20, 2005

Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management

INCEP TECHNOLOGIES29 citations89

NCR CORP

1 patent

US6401805B1Jun 11, 2002

Integrated venting EMI shield and heatsink component for electronic equipment enclosures

NCR CORP8 citations71