Inventor
LEE JU-BUM
KR15 patents
⚠️ This page may combine multiple inventors who share the name “LEE JU-BUM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
14 patentsUS7033909B2Apr 25, 2006
Method of forming trench isolations
SAMSUNG ELECTRONICS CO LTD65 citations97
US7125774B2Oct 24, 2006
Method of manufacturing transistor having recessed channel
SAMSUNG ELECTRONICS CO LTD28 citations92
US6762126B2Jul 13, 2004
Method of forming an interlayer dielectric film
SAMSUNG ELECTRONICS CO LTD52 citations92
US6563162B2May 13, 2003
Semiconductor memory device for reducing parasitic bit line capacitance and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD40 citations92
US6372672B1Apr 16, 2002
Method of forming a silicon nitride layer in a semiconductor device
SAMSUNG ELECTRONICS CO LTD28 citations92
US6964922B2Nov 15, 2005
Methods for forming metal interconnections for semiconductor devices having multiple metal depositions
SAMSUNG ELECTRONICS CO LTD13 citations84
US7459745B2Dec 2, 2008
Methods of forming capacitors for semiconductor memory devices and resulting semiconductor memory devices
SAMSUNG ELECTRONICS CO LTD15 citations83
US7335589B2Feb 26, 2008
Method of forming contact via through multiple layers of dielectric material
SAMSUNG ELECTRONICS CO LTD9 citations83
US6645879B2Nov 11, 2003
Method of forming a silicon oxide layer of a semiconductor device and method of forming a wiring having the same
SAMSUNG ELECTRONICS CO LTD7 citations73
US7288454B2Oct 30, 2007
Methods of forming capacitors for semiconductor memory devices and resulting semiconductor memory devices
SAMSUNG ELECTRONICS CO LTD9 citations72
US7442607B2Oct 28, 2008
Method of manufacturing transistor having recessed channel
SAMSUNG ELECTRONICS CO LTD4 citations63
US5670400ASep 23, 1997
Method for making dual gate insulating film without edge-thinning
SAMSUNG ELECTRONICS CO LTD5 citations63
US6982223B2Jan 3, 2006
Method of manufacturing a semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations61
US7439150B2Oct 21, 2008
Method of manufacturing a semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51