P

Inventor

LEE HO-JIN

KR184 patents
⚠️ This page may combine multiple inventors who share the name “LEE HO-JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

16 patents
US9941243B2Apr 10, 2018

Wafer-to-wafer bonding structure

SAMSUNG ELECTRONICS CO LTD237 citations99
US10577199B2Mar 3, 2020

Robot cleaner, refrigerator, container transfer system, and method of transferring and retrieving container using the robot cleaner

SAMSUNG ELECTRONICS CO LTD20 citations93
US7572673B2Aug 11, 2009

Wafer level package having a stress relief spacer and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD18 citations92
US10468400B2Nov 5, 2019

Method of manufacturing substrate structure

SAMSUNG ELECTRONICS CO LTD8 citations84
US10325869B2Jun 18, 2019

Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices

SAMSUNG ELECTRONICS CO LTD6 citations84
US9935037B2Apr 3, 2018

Multi-stacked device having TSV structure

SAMSUNG ELECTRONICS CO LTD13 citations84
US9824973B2Nov 21, 2017

Integrated circuit devices having through-silicon via structures and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD7 citations84
US9343361B2May 17, 2016

Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

SAMSUNG ELECTRONICS CO LTD11 citations84
US8941216B2Jan 27, 2015

Semiconductor devices having through-vias and methods for fabricating the same

SAMSUNG ELECTRONICS CO LTD7 citations84
US7875552B2Jan 25, 2011

Methods of forming integrated circuit chips having vertically extended through-substrate vias therein and chips formed thereby

SAMSUNG ELECTRONICS CO LTD7 citations84
US7777345B2Aug 17, 2010

Semiconductor device having through electrode and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD12 citations84
US9530706B2Dec 27, 2016

Semiconductor devices having hybrid stacking structures and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD13 citations83
US8927426B2Jan 6, 2015

Semiconductor devices having through-vias and methods for fabricating the same

SAMSUNG ELECTRONICS CO LTD10 citations83
US9806004B2Oct 31, 2017

Semiconductor devices having a TSV, a front-side bumping pad, and a back-side bumping pad

SAMSUNG ELECTRONICS CO LTD8 citations82
US8362621B2Jan 29, 2013

Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD14 citations82
US10325897B2Jun 18, 2019

Method for fabricating substrate structure and substrate structure fabricated by using the method

SAMSUNG ELECTRONICS CO LTD4 citations73

KOREA ELECTRONICS TELECOMM

12 patents
US7616710B2Nov 10, 2009

Frequency offset estimating method and receiver employing the same

KOREA ELECTRONICS TELECOMM57 citations95
US7324465B2Jan 29, 2008

Random access channel access apparatus for mobile satellite communication system and method therefor

KOREA ELECTRONICS TELECOMM47 citations92
US6925132B2Aug 2, 2005

Method for detecting and correcting amplitude and phase imbalances between I and Q components in quadrature demodulator

KOREA ELECTRONICS TELECOMM33 citations92
US6802037B2Oct 5, 2004

Iterative decoding method for block turbo codes of greater than three dimensions

KOREA ELECTRONICS TELECOMM22 citations92
US5721810AFeb 24, 1998

Method of automatically controlling and verifying telecommands in satellite control system

KOREA ELECTRONICS TELECOMM21 citations88
US7346069B2Mar 18, 2008

Apparatus and method for dynamic resource allocation in interactive satellite multimedia system

KOREA ELECTRONICS TELECOMM13 citations84
US7310387B2Dec 18, 2007

Apparatus for compensating DC offsets, gain and phase imbalances between I-channel and Q-channel in quadrature transceiving system

KOREA ELECTRONICS TELECOMM14 citations84
US7187725B2Mar 6, 2007

Method and apparatus for compensating I/Q imbalance by using variable loop gain in quadrature demodulator

KOREA ELECTRONICS TELECOMM15 citations84
US8049319B2Nov 1, 2011

Ultra wideband system-on-package

KOREA ELECTRONICS TELECOMM7 citations83
US7940713B2May 10, 2011

Apparatus and method for traffic performance improvement and traffic security in interactive satellite communication system

KOREA ELECTRONICS TELECOMM10 citations82
US7248654B2Jul 24, 2007

Apparatus and method for compensating I/Q imbalance based on gain-controlled reference channel in orthogonal frequency division multiplex

KOREA ELECTRONICS TELECOMM8 citations74
US6909888B2Jun 21, 2005

System for estimating traffic rate of calls in wireless personal communication environment and method for the same

KOREA ELECTRONICS TELECOMM9 citations74

LEE HO-JIN

10 patents

DAEWOO ELECTRONICS CO LTD

1 patent

UTSTARCOM INC

1 patent

HYUNDAI MOTOR CO LTD

1 patent

LEE HO JIN

1 patent

CHUNG HYUN-SOO

1 patent

LEE IN KI

1 patent

KT CORP

1 patent

NAVER BUSINESS PLATFORM CORP

1 patent

YOU BYOUNG-GAE

1 patent

NAM SEUNG HYUN

1 patent

KWAK CHANGSOO

1 patent

ELECTRONICS & TELECOMMUNICATIONS RES INST

1 patent

Showing the top 50 of 184 patents by PatentIndex Score.