Inventor

HE DONGMING

US19 patents

⚠️ This page may combine multiple inventors who share the name “HE DONGMING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HE DONGMING

QUALCOMM INC

Stacked multi-chip integrated circuit package

Stacked multi-chip integrated circuit package

Package comprising optical integrated device

Flip-chip device

Thermal compression flip chip bump for high performance and fine pitch

Package comprising spacers between integrated devices

Sidewall wetting barrier for conductive pillars

Flip-chip flexible under bump metallization size

Integrated device comprising pillar interconnect with cavity

Flip-chip bumping metal layer and bump structure

Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methods

INTEL CORP

Embedded on-die laser source and optical interconnect

Integrated circuit packages with reduced stress on die and associated substrates, assemblies, and systems

C4 joint reliability

Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same

Integrated circuit packages with reduced stress on die and associated methods

C4 joint reliability

UNIV ILLINOIS

Integrated thin film liquid conductivity sensor

NINGDE AMPEREX TECHNOLOGY LTD

Separator and electrochemical device