Inventor
YUN CHEOL-JU
KR28 patents
Patents
28 patentsUS7488644B2Feb 10, 2009
Method of fabricating a semiconductor device
SAMSUNG ELECTRONICS CO LTD20 citations92
US7056786B2Jun 6, 2006
Self-aligned buried contact pair and method of forming the same
SAMSUNG ELECTRONICS CO LTD20 citations92
US7326613B2Feb 5, 2008
Methods of manufacturing semiconductor devices having elongated contact plugs
SAMSUNG ELECTRONICS CO LTD9 citations84
US7247541B2Jul 24, 2007
Method of manufacturing a semiconductor memory device including a transistor
SAMSUNG ELECTRONICS CO LTD12 citations84
US7205232B2Apr 17, 2007
Method of forming a self-aligned contact structure using a sacrificial mask layer
SAMSUNG ELECTRONICS CO LTD13 citations84
US7078292B2Jul 18, 2006
Storage node contact forming method and structure for use in semiconductor memory
SAMSUNG ELECTRONICS CO LTD20 citations84
US7026246B2Apr 11, 2006
Method of cleaning semiconductor substrates after forming tungsten patterns
SAMSUNG ELECTRONICS CO LTD15 citations84
US6967150B2Nov 22, 2005
Method of forming self-aligned contact in fabricating semiconductor device
SAMSUNG ELECTRONICS CO LTD16 citations84
US6916738B2Jul 12, 2005
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD13 citations84
US7321146B2Jan 22, 2008
DRAM memory cell and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD11 citations83
US7030439B2Apr 18, 2006
DRAM memory cell and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD11 citations83
US9184091B2Nov 10, 2015
Semiconductor device and method of forming the same
SAMSUNG ELECTRONICS CO LTD14 citations82
US8987860B2Mar 24, 2015
Semiconductor device
SAMSUNG ELECTRONICS CO LTD10 citations81
US7388243B2Jun 17, 2008
Self-Aligned buried contact pair
SAMSUNG ELECTRONICS CO LTD8 citations74
US7180118B2Feb 20, 2007
Semiconductor device including storage node and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD7 citations74
US6773338B2Aug 10, 2004
Polishing head and chemical mechanical polishing apparatus including the same
SAMSUNG ELECTRONICS CO LTD7 citations74
US8946077B2Feb 3, 2015
Method of manufacturing a semiconductor device
SAMSUNG ELECTRONICS CO LTD6 citations71
US7557410B2Jul 7, 2009
Dynamic random access memory device
SAMSUNG ELECTRONICS CO LTD2 citations63
US7547938B2Jun 16, 2009
Semiconductor devices having elongated contact plugs
SAMSUNG ELECTRONICS CO LTD3 citations63
US7482222B2Jan 27, 2009
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations63
US7476585B2Jan 13, 2009
Semiconductor device including storage node and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations63
US7307305B2Dec 11, 2007
Semiconductor device
SAMSUNG ELECTRONICS CO LTD4 citations63
US7691719B2Apr 6, 2010
Semiconductor device having storage nodes and its method of fabrication
SAMSUNG ELECTRONICS CO LTD2 citations62
US6635582B2Oct 21, 2003
Method of manufacturing semiconductor device
SAMSUNG ELECTRONICS CO LTD6 citations62
US12211891B2Jan 28, 2025
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations59
US12356610B2Jul 8, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations52
US7166507B2Jan 23, 2007
Semiconductor device and method for forming same using multi-layered hard mask
SAMSUNG ELECTRONICS CO LTD1 citations52
US9343355B2May 17, 2016
Wiring structures including spacers and an airgap defined thereby, and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations49